What can Wolfspeed do for you?

• You will be a part of the leading edge of the conversion to Silicon Carbide, a technology that is leveraged in all things future including Electric Cars, Solar Energy, Charging Stations, and 5G Communications to name just a few.

• Gain invaluable exposure to a wide array of manufacturing techniques and tools and be a part of driving the evolution of SiC Power Device development

• You will work with vendors and customers from markets all over the globe and have a real impact on Wolfspeed’s future.

What can you do for Wolfspeed?

• Working with our Wafer Fabs to report and react to wafer Test, Dice, and Inspection results. 

• Work directly with our contract manufacturing partners across the globe to improve the manufacturing capability and product performance across our product portfolio.

• Resolve everyday manufacturing issues while addressing big picture challenges as we build the largest SiC based Power device company in the world.

• Work with Engineers, Scientists, Designers, Technicians, and Operations leaders throughout the entire manufacturing process to lead projects and transfer in to production new products and processes.

• Review test and yield trends across the Power Product Lines and be the first responder to yield anomalies.

• Develop, document and deploy process improvements which enhance yield, cycle time, and long term reliability for SiC Power devices.

• Document manufacturing process flows, requiring clear written and verbal communication skills. Documentation includes travelers, control plan, process flow spec, PFMEAs, inspection requirements, and split lot instructions.

• Participation and ownership where appropriate of 8Ds for scrapped material and MRB data review and close-out.

• Perform independently on routine assignments.  Must be able to follow specific instructions to perform tasks that require a higher knowledge of engineering techniques in supporting SiC Power production requirements.

• Mentoring, coaching and training of process technicians and operators.

What you need for success:

• Bachelor’s degree in Electrical Engineering, Chemical Engineering, Industrial Engineering or Materials Science.

• 2+ years of experience in semiconductor fabrication or back-end processing (probe, AVI, Saw) as a process or product engineer.

• Ability to pull and analyze large data sets from manufacturing processing.

• High energy and self-motivated individual with strong communication skills to deliver results in a timely manner.

• This position requires the lawful ability to access technical data, information, and areas controlled by United States export control laws and regulations.

Highly preferred skills and certifications:

• Demonstrated understanding of semiconductor back-end and assembly processing, including: dicing, die attach, wire bond, encapsulation. 

• 5+ years of experience in semiconductor fabrication as a process, product or process integration engineer.

• Demonstrated understanding of the science and technology needed to fabricate semiconductor devices including ion implantation, oxide growth, diffusion, photolithography, wet and dry etch, thin film deposition and metal deposition.

• General understanding of the process flow for inspection, monitoring and disposition of semiconductor products. SiC experience is a plus.

• Good working knowledge of semiconductor device physics.

• Familiarity with ANOVA, DOE principles, SPC techniques, JMP software. JMP scripting is a plus.