Staff Engineer, Packaging Engineering

Company Description

ABOUT WESTERN DIGITAL

The future. It’s on you. You & Western Digital.

We’ve been storing the world’s data for more than 50 years. Once, it was the most important thing we could do for data. Now we’re helping the world capture, preserve, access and transform data in a way only we can.

The most game-changing companies, consumers, professionals, and governments come to us for the technologies and solutions they need to capture, preserve, access, and transform their data.

But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data.

Western Digital® data-centric solutions are found under the G-Technology™, HGST, SanDisk®, Tegile™, Upthere™, and WD® brands.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

As a package thermal design engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.

In this position, you will be responsible for influencing package and product thermal designs and advancing the technology of semiconductor packaging.

Scope is to address all thermal aspects of packaging technology and associated material and process interactions.

Focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.

Candidate will be responsible for the modeling and characterization of thermal response of the flash products and SSD PCBA using analysis and measurement techniques.

This position will interface with package & product design, electrical and physical characterization, assembly R&D and other process teams.

Lab work will be required.

Qualifications

Solid knowledge through academic coursework or experience required in thermal modeling and measurements of IC packaging and related areas.

A strong background in thermal sciences with emphasis on both analytical and measurement methods.

Thorough knowledge of material thermal properties and test methods.

Working knowledge in applying Computational Fluid Dynamics (CFD) in related areas; and familiarity with software tools such as FloTHERM and ANSYS Icepak.

Working knowledge in scientific programming

A good understanding of semiconductor packaging processes, materials, technology, and trends such as: substrate design and manufacturing, molding, wire-bonding, die attach, flip chip, etc.

Strong oral and written communication skills.

Demonstrated strong work ethic.

Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.

Qualifications

REQUIRED:

MS in mechanical engineering + 3 yr industry experience is required.

Ph.D. in is preferred

PREFERRED:

Knowledge of machine learning is a plus

Thermal management understanding is a plus

Additional Information

Because Western Digital thrives on the power of diversity and is committed to an inclusive environment where every individual can thrive through a sense of belonging, respect, and contribution, we are committed to giving every qualified applicant and employee an equal opportunity.  Western Digital does not discriminate against any applicant or employee based on their protected class status and complies with all federal and state laws against discrimination, harassment, and retaliation, as well as the laws and regulations set forth in the "Equal Employment Opportunity is the Law" poster.