Real job — pulled straight from Texas Instruments’s careers page · Verified October 31, 2026 · No reposts.
Job description
Texas Instruments is hiring a Electromagnetics and Packaging Design Engineer — a full-time, based in Dallas, TX role. Apply directly on Texas Instruments's careers page below.
Electromagnetics (EM) and Packaging Design Engineer
Location: Dallas, TX, United States
We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.
Kilby Labs is the advanced R&D and product development support organization within TI chartered to define and develop new and innovative technologies and solutions in collaboration with business units and customers.
As a member of Kilby Labs you’ll have the chance to interact with many product groups and functions, work with an interdisciplinary team, and bridge from lab to fab to develop technologies to enable new markets.
About the Position
Kilby Labs is seeking a highly motivated and experienced electromagnetic modeling engineer to support various TI product development, including Silicon Photonics, RF filters and 2.5D/3D heterogeneously integrated systems. This role is responsible for the RF modeling of new technology platforms and product ideas. The role requires working extensively across other internal teams including advanced process technology development (ATD), packaging, chip design and test, and product engineering, to make innovative, high performance and cost-effective solutions. This position is ideal for individuals interested in RF design, electromagnetics, filter design, RFIC and module co-design, and advanced/heterogeneous packaging technologies. For this role we are seeking a creative problem-solver who can develop unique and breakthrough solutions.
Responsibilities may include, but are not limited to:
- Drive and execute the strategy of high frequency and high-speed interconnect simulations for various product developments.
- Lead the electromagnetic modeling needs of the team for various applications; such as advanced packages, TSVs, heterogeneously integrated 2.5D/3D systems.
- Build and analyze electromagnetic models of RF passive structures, including: filters, matching networks, baluns, couplers, RF transitions and interconnects.
- Perform electromagnetic simulations using tools such as HFSS and EMX
- With extracted S-parameters, run circuit and system-level simulations.
- Investigate RF interactions between the circuits, package structures, and passive components.
- Drawing mask layouts for test structures for proof-of-concept studies, as well as supporting technology development activities
- Evaluate design trade-offs related to performance, and manufacturability.
About Us
- The future starts here. As a TIer, you'll play a critical role in defining the next era of semiconductor technology and help create the innovations that shape the world around us.
- Surround yourself with a team of innovators who value your unique perspective and will challenge you to bring your best self to work every day. We believe that fostering a culture of collaboration fuels both personal growth and technological breakthroughs. Explore our company culture.
- At TI, your success goes beyond your work. Take advantage of comprehensive benefits designed to support your total well-being at work and in life, from competitive compensation to extensive health coverage and wellness programs. Learn more about our benefits offerings.
About the Organization
TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.Get Design Engineer jobs like this→
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Frequently asked questions
What is the seniority level for Electromagnetics and Packaging Design Engineer at Texas Instruments?
Electromagnetics and Packaging Design Engineer at Texas Instruments is a Senior level position.
How do I apply for Electromagnetics and Packaging Design Engineer at Texas Instruments?
You can view the full description and apply for Electromagnetics and Packaging Design Engineer at Texas Instruments on EchoJobs: https://echojobs.io/job/texas-instruments-electromagnetics-em-and-packaging-design-engineer-vwpl4.