CMP Manufacturing Process Engineer
Location: Lehi, UT, United States
Join the Revolution in Semiconductor Manufacturing at LFAB!
We're at the forefront of an exciting era of growth and innovation at LFAB (Lehi Fab), where our state-of-the-art manufacturing facilities are driving the production of a vast portfolio of semiconductor products. As we rapidly expand our capabilities with the construction of LFAB2, we're seeking talented and experienced CMP Process Engineers to join our team and play a key role in shaping the future of our industry. With production and yields on the rise, this is an unparalleled opportunity to make a meaningful impact and contribute to the success of our organization. If you're a motivated and seasoned Engineer with more than 5 years of experience in the semiconductor industry within the Chemical Mechanical Planarization (CMP) process area, we invite you to join our dynamic team and help us push the boundaries of what's possible in semiconductor manufacturing.
The responsibilities of a CMP Manufacturing Process Engineer in this role include:
Support manufacturing operations for CMP processes across multiple technology nodes
Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
Support the manufacturing ramp with execution of CMP equipment/process startup, process experiments (SWRs), and process qualifications
Develop and implement improved methods of CMP manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and product quality
Optimize CMP processes including slurry chemistry, pad conditioning, polish rates, and consumable performance
Implement project or improvement plans for areas of responsibility including but not limited to: defect reduction, non-uniformity improvements, cost reduction through consumable optimization, quality improvement programs, new product support and other CMP process improvements
Participate in data analysis and problem resolution related to CMP metrology including film thickness, surface roughness, defectivity, and planarization efficiency
Monitor and optimize CMP tool performance, including polish time, removal rates, within-wafer non-uniformity (WIWNU), and wafer-to-wafer non-uniformity (WTWNU)
Work onsite and be responsive to evening and weekend escalations as needed
Collaborate with equipment vendors, slurry suppliers, and pad manufacturers to evaluate and implement new CMP technologies and consumables
Drive root cause analysis and corrective actions for CMP-related yield excursions and defect issues
About Us
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
About the Organization
TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.There are more than 50,000 engineering jobs:
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