2027校招 - 失效分析工程师 / Failure Analysis Engineer

Location: Shanghai, China

Change the world. Love your job.
In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job. The TMG Development program is a 12-month program for new college graduates in the TMG organization.

TI's failure analysis engineers are responsible for technical functions in support of engineering activities such as characterization design, test, checkout, modifications of assembly technologies and die level failure analysis and circuit analysis. This position provides the opportunity for interacting with wafer fab processing and assembly/test care-about while interfacing with design engineering, product engineering and CQE.

Responsibilities include:

• Circuit analysis, bench level equipment skills, die level deprocessing, report writing
• Ability to work from schematic diagrams, written and verbal descriptions, layouts or defined plans to perform testing, checkout, and trouble-shooting functions
• Perform bench level electrical verification/fault isolation on integrated circuits to determine root cause of failure
• Must become proficient in a variety of failure analysis techniques and equipment operation
• Excellent judgment required to isolate failures for accurate identification of defect locations
• Individual is responsible for managing the failure analysis process in conjunction with their own skill set development
• Work in a team environment and provide consultation for non-F/A disciplines
• Write detailed failure analysis report

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