OUR STORY
At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.
When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!
Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.
YOUR ROLE
- To lead the team of Die Attach engineers.
- To develop and to industrialize Die Attach Process including epoxy glue, soft solder, DAF die attach, Flip Chip for new lead frame packages, materials to meet the quality, yield and mission of new application
- To support assembly of engineering sample for new packages or new technologies.
- To characterize new die attach process and materials.
- To generate and update process specifications, SOP, FMEA and process control plan
- To provide technical support when there are critical quality concerns related to Die Attach material / process
YOUR SKILLS & EXPERIENCES
- Master or Bachelor Degree in Mechanical Engineering / Material Science / Electrical Engineering / Electronics Engineering or equivalent engineering field.
- Minimum 5 years of working experience in Die Attach process
- Skilled in Design of Experiment (DOE) and analytical troubleshooting.
- Good interpersonal skills and able to work well under pressure.
Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future!
To discover more, visit st.com/careers
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