OUR STORY
At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.
When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!
Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.
YOUR ROLE
As part of ST Backend R&D organization, you will be responsible for leading the development of new packaging solutions for our products. You will work closely with cross-functional teams to develop and launch new packaging solutions that meet customer needs and business objectives.
- Be part of WLCSP package development team, work as technical project manager to lead the engineering activities on New Product Introduction (NPI) for Wafer Level Chip Scale Package (WLCSP) packaging, including Fan in, Fan out, and optical sensor (CIS/ALS) module.
- Lead the engineering activities from feasibility study, prototype build, DOE planning and execution until product full qualification to start production. Ensure new product package development project adherence to timeline and achieve all major milestone target.
- Working with various cross functional organizations such as internal team, subcontractor partners and customer to bring product from development to volume production.
- Define standard process and implement best-known method and lesson learnt during project execution.
- Support new process brick development as a future technical enabler align with the defined roadmap.
YOUR SKILLS & EXPERIENCES
- Bachelor’s Degree in Engineering
- Min 4 years of working experience in WLCSP package development, in depth knowledge in WLCSP assembly process (bumping).
- Experience with TSV process is a plus.
- Experience with production line operation is a plus.
- Familiar with process package R&D activity or NPI project management methodology.
- Familiar with semiconductor industry tools such as FMEA, 8D, SPC, OCAP.
- Excellent communication skills. Experience in working with multiple organizations.
Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future!
To discover more, visit st.com/careers
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