Sr. Quality Engineer, Silicon Technology (Starlink)

SR. QUALITY ENGINEER, SILICON TECHNOLOGY (STARLINK)

SpaceX is leveraging its experience in building rockets and spacecraft to deploy Starlink, the world’s most advanced broadband internet system. Starlink is the world’s largest satellite constellation and is providing fast, reliable internet to 4M+ users worldwide. We design, build, test, and operate all parts of the system – thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We’ve only begun to scratch the surface of Starlink’s potential global impact. As we continue to upgrade and expand the constellation, we’re looking for best-in-class engineers to join the team.

In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. We are looking for hands-on and dynamic quality engineers with expertise in semiconductors, packaging assembly processes, and test. You will assume full ownership of quality packaging assembly materials, processes, and products as we strive to make Starlink more affordable to those that need it most.

RESPONSIBILITIES:  

• Own quality for in-house packaging assembly lines including for incoming goods, within assembly line processes, and outgoing finish products
• Lead failure analysis investigations, root cause analysis, corrective actions, and reporting for chip packaging assembly and test failures
• Cross-functional interface between external suppliers, engineering, operations, and stakeholders in identifying and establishing quality metrics to meet yield and reliability targets
• Drive and implement changes to improve the quality and reliability of assembly processes and test environments
• Responsible for isolating excursions and immediately driving containment actions to minimize operational and customer product impact
• Identify, create and review specifications for incoming supplies & materials to ensure they meet product requirements
• Own quality metrics, ongoing reliability reporting, risk assessment activities, and reliability improvement plans
• Implement quality and reliability improvements for next generation SpaceX chip packaging products

BASIC QUALIFICATIONS: 

• Bachelor’s degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other applied engineering discipline  
• 5+ years of professional experience in quality, failure analysis, and/or semiconductor assembly and packaging

PREFERRED SKILLS AND EXPERIENCE: 

• Advanced technical degree
• 7+ years industry experience in microelectronics packaging quality and/or reliability
• Familiar with failure mode and effects analysis FMEA and 8D reporting
• Packaging familiarity with flip-chip, BGA, fcCSP, WLCSP, fan out FO processes, system-in-package SiP, multi-chip modules MCM, wirebond, panel level packaging, heterogenous and chiplet integration
• Hands-on packaging, PCBA, failure analysis, reliability and/or testing
• OSAT (outsource semiconductor assembly and test) experience a plus