Silicon Assembly Engineer (Starlink)

Location: Bastrop, TX

Department: Starlink Production - Silicon Assembly

SILICON ASSEMBLY ENGINEER (STARLINK)

One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, test engineers, equipment manufacturers, and leadership.

The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver. If you seek a fast-paced, dynamic environment; if you thrive on solving difficult problems where resolutions have high impact; and if you love the challenge of building something from scratch, then this role will be an ideal next career step.

RESPONSIBILITIES:

• Own, operate and maintain deposition systems, including physical vapor deposition (PVD) to deposit precise thin films of metals, dielectrics, & compound semiconductors
• Own, operate and maintain wet & dry etching processes to include developing new and optimizing existing processes
• Develop and optimize deposition recipes by tuning parameters such as temperature, pressure, gas flow rates, and precursor delivery to achieve target film thickness and composition levels
• Monitor process performance using in-situ sensors and metrology equipment like 3D profilometers, ellipsometers, reflectometers, and X-ray fluorescence (XRF) to ensure film uniformity, step coverage, and contamination control
• Troubleshoot equipment malfunctions, analyze process drifts, and perform root cause investigations to minimize defects and enhance deposition rates
• Collaborate with process integration, lithography, and etching teams to qualify new materials and integrate deposition steps into overall device fabrication flows
• Document process data, prepare reports on key metrics (e.g., deposition rate, film resistivity, refractive index), and contribute to design of experiments (DOE) for process enhancements
• Assist in tool installations, preventive maintenance, and qualification testing to support high-volume production and rapid prototyping
• Provide detailed documentation of procedural steps and training aides for team of production technicians and associates. Monitor adherence to protocols & provide individual remediation as necessary

BASIC QUALIFICATIONS:

• Bachelor's degree in an engineering, math, or science discipline
• 1+ years of experience in a manufacturing environment via professional work experience, project/research-based student experience, or a combination of both

PREFERRED SKILLS AND EXPERIENCE:

• Bachelor's degree in materials science, chemical engineering, electrical engineering, or a related field
• 3+ years of practical experience in semiconductor deposition processes in a fabrication setting
• Strong knowledge of deposition methods, including ALD, PECVD, LPCVD, PVD, plasma sputtering with understanding of various thin film properties and high vacuum environments
• Proficiency in data analysis and process control software (e.g., JMP, SQL) for statistical process control (SPC) and trend analysis
• Experience with high-k dielectrics, advanced metals (e.g., Cu, Ti, SuS), or 3D structures
• Background in R&D projects involving novel thin films, such as perovskites or graphene, and integration with factory automation systems
• Experience in New Product Integration activities, First Article Verification Processes (FAIR), & scaling into High Volume Manufacturing (HVM) as part of cross-functional teams
• Background in yield optimization and automation integration (e.g., with MES systems)

ADDITIONAL REQUIREMENTS:

• Must be able to work all shifts & be willing to work overtime and weekends as needed
• Able to travel up to 10% as needed for vendor engagement and Factory Acceptance Testing
• Standing for long periods of time, climbing up and down ladders, bending, grasping, sitting, pulling, pushing, stooping, and stretching
• Ability to lift up to 35 lbs. unassisted