Senior Process Engineer, Test and Packaging

Key Responsibilities

• Wafer/Die/Package Testing:
• Sustain wafer probe equipment to test electrical properties of superconducting quantum circuits.
• Develop and deploy new test programs and functions on the equipment in a production environment.
• Troubleshoot and resolve issues related to probe equipment and test procedures including but not limited to electrostatic damage (ESD).
• Experience working with low level measurement and various types of probe cards and understanding their applications and resolution of related issues


• Packaging:
• Take ownership of assembly and packaging equipment and processes including, but not limited to: die attach, wire bonding, flip chip attach, wafer singulation, wafer bonding and other packaging processes.
• Create packaging diagrams and specify requirements for assembly tooling, fixtures and equipment to support manufacturing operations and damage free die handling.

Additional Responsibilities

• Support test, assembly and packaging development activities working through the evolution details of next generation process/architecture/product/approach, collaborating with other frontend and backend modules.
• Establish process metrologies, key metrics, and parameters. Document and maintain monitors and statistical process controls to run a predictable and capable process.
• Create specifications, document processes and written work instructions for production deployment.
• Guide technicians and operators in process and equipment operation and troubleshooting. 
• Maintain and monitor failure pareto from daily production activities, and recommend product and process improvements to enhance yield and efficiency.
• Organize failure data, draw correlations from process interactions and present results in a concise fashion.
• Prepare process requirement documents in defining and acquiring new equipment. Install and qualify new equipment and establish processes.
• Key member of the team to continue developing Rigetti Fab as a leading quantum integrated circuit foundry.

About You

• Disciplined hands-on approach to development work and technical problem solving.
• MS and/or Ph.D. in Science or Engineering field is highly preferred.
• At least 3-7+ years of hands-on experience in wide range of semiconductor/MEMS e-test, assembly and packaging tools, such as wafer probers, package probers, wire bonders, die attach, epoxy dispense, flip-chip assembly, surface mount technology (SMT), flux/solder (paste and solder balls), underfilling and cure, and relevant metrology tools. Hands-on experience in die-prep tools, such as wafer mount, wafer singulation, and die eject and handling. Familiar with temporary and permanent wafer bonding.
• Strong understanding of semiconductor fabrication processes and electrical measurement instrumentation. Experience with superconducting materials is a plus.
• Good understanding of cross-functional packaging areas is a definite plus. Familiarity in reviewing Silicon floor plan, package layout and architecture, thermal, mechanical, material, component & system level reliability, testing and failure analysis preferred.
• Strong communication skills. Ability to work in a cross-functional team.
• Ability to work independently and manage priorities and stakeholders. Ability to deal with ambiguity in defining activities and direction.
• Strong background in SPC and DOE methodologies, GR&R, root-cause fixes and application of containment solutions.
• Comfortable working in cleanroom fab adhering to HAZMAT and ESD practices.
• High degree of comfort with a flexible and agile company environment. Flexibility in work hours and work days.
• Comfortable with MS Office products, JMP, Solid Works, Google Docs. Experience with Python scripting and Data analysis is a plus.