Senior Hardware Engineer – Digital, Power and FPGA

Location: Chennai, India (IN)

Experience Level: Senior

Description

RADWIN | Chennai, India | Full-time

The Role

RADWIN is looking for a hands-on Senior Hardware Engineer to develop next-generation wireless platforms based on Qualcomm networking SoCs, ARM-based processors, and FPGAs.

Reporting to the Platform Group Manager, you will take technical ownership of digital and power hardware development, from architecture and schematic design through board bring-up, validation, and production. You will work closely with RF and antenna, mechanical, software, firmware, compliance, and manufacturing teams.

Responsibilities

• Develop hardware architectures, block diagrams, and detailed designs, taking projects from concept through mass production.
• Design processor-based boards using Qualcomm SoCs and other ARM-based processors, including DDR memory, flash, PCIe, USB, Ethernet/SerDes interfaces, clocking, and reset circuits.
• Design power systems, including multi-rail PMICs, DC/DC converters, power sequencing, PoE (PD/PSE), protection circuits, and power budgets for outdoor products operating across wide temperature ranges.
• Develop FPGA board designs, including device selection, pin planning, configuration, high-speed interfaces, and integration with FPGA and firmware engineers.
• Create and maintain schematics in OrCAD Capture. Guide PCB layout, define stack-up and signal- and power-integrity constraints, and review component placement and routing.
• Perform signal-integrity, power-integrity, and thermal analyses, validating results against lab measurements.
• Bring up and debug complex boards with software and firmware teams using oscilloscopes, logic and protocol analyzers, JTAG, and power analyzers.
• Define and execute hardware design verification tests, including margin, temperature, power, and reliability testing. Support EMC, surge, and safety qualification.
• Work with Qualcomm and other component vendors on reference designs, design reviews, and technical issue resolution.
• Support manufacturing test development, production troubleshooting, component obsolescence, and design improvements.
• Contribute to design reviews, engineering documentation, and design guidelines, and share technical expertise with other engineers.

Requirements

Requirements

• BSc in Electrical Engineering.
• At least 10 years of hands-on digital hardware design experience.
• Proven ability to independently own complex hardware designs from architecture through production.
• Experience designing boards based on Qualcomm SoCs, such as IPQ networking platforms, or comparable high-performance processors.
• Strong high-speed digital design experience, including DDR3/4/LPDDR, PCIe, USB 3.x, multi-gigabit Ethernet, and SerDes.
• In-depth experience with DC/DC converters, PMICs, power sequencing, and PoE.
• Hands-on FPGA board design experience using AMD/Xilinx, Intel/Altera, or Lattice devices.
• Proficiency in OrCAD Capture and experience guiding and reviewing PCB layouts in Allegro or equivalent tools.
• Experience with SI/PI simulation tools such as HyperLynx, SIwave, or Sigrity.
• Strong board bring-up and lab debugging skills on complex multilayer boards.
• Experience with EMC, surge, and safety standards, such as EN 55032, IEC 61000-4-x, and IEC 62368-1.
• Strong communication skills and the ability to collaborate across engineering disciplines.
• Excellent written and spoken English.

Advantages

• MSc in Electrical Engineering.
• Experience with telecom, wireless, or outdoor networking equipment.
• Experience with Wi-Fi 6/7 access points or base stations.
• HDL knowledge, including VHDL/Verilog, and experience with FPGA timing closure.
• Experience with timing and synchronization technologies, including SyncE, IEEE 1588, and GNSS.
• Familiarity with railway or industrial standards, including EN 50155 and EN 50121.
• Python scripting for test automation.
• Experience working with contract manufacturers in Asia.
• Experience mentoring engineers or providing technical leadership.