Thermal Engineer

Location: Hsinchu City, Taiwan

Department: Packaging Engineering

Work Location: onsite

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Qualcomm’s Hardware System is seeking a talented Thermal Engineer to contribute to continued success of our industry-leading portfolio of chipset solutions. The qualified individual will be contributing to innovative solutions to resolve complex thermal mgmt. challenges across IoT, Wearable, and Mobile platforms. The ideal individual should have in-depth understanding of heat transfer fundamentals and be familiar with micro-electronics cooling of consumer and industrial devices. He/she must have experience in developing analytical and numerical models using CFD tools. In addition, hands-on experience conducting thermal tests in support of product development is required. Further, strong understanding of thermal mgmt. materials and emerging cooling technologies to enhance thermal performance is essential.

Responsibilities

• Support thermal and mechanical projects from concept through production.

• Perform thermal modeling and simulations using CFD tools for product-level solutions and present results.

• Design, set up, execute, and analyze various thermal tests.

• Research and evaluate novel cooling technologies, materials, and thermal solutions.

• Manage technical projects across organization

Skills/Experience

• Proficiency in thermal modeling and simulation using tools such as ANSYS-Icepak or FloTHERM.

• Hands-on experience designing and executing thermal tests in a laboratory environment.

• Scripting and data analysis skills desirable.

• Programming experience with Python and C/C++.

• Experience with 3D CAD tools such as Solidworks or Creo.

• Familiarity with data acquisition system and thermal measurement tools (e.g. IR camera, Thermocouple, flow meter).

• Experience disassembling and assembling electronic devices to support modeling and testing.

• Ability to utilize AI tools to enhance simulations and testing workflows. - Strong understanding of cooling techniques for consumer and industrial electronic devices.

• In-depth knowledge of conduction, radiation, natural and forced convection. - Experience in design and sizing heat sinks.

• Excellent communication skills.

Education Requirements

• Required: BSME

• Preferred: MSME, or PhD in Mechanical Engineering

Keywords

Micro-electronic device, heat transfer, CFD, ANSYS-Icepak, FloTHERM, thermal management, thermal test, conduction, convection, radiation, mechanical design

Minimum Qualifications:

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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