Thermal Engineer, Senior

Location: Bangalore, Karnataka, India

Department: Mechanical Engineering

Work Location: onsite

Company:

Qualcomm India Private Limited

Job Area:

Engineering Group, Engineering Group > Mechanical Engineering

General Summary:

Job Title: Senior Engineer

Location: Bangalore (regular 5-day work week)                                                                          

Job Overview:

The successful candidate will operate as a member of Corporate Engineering Hyderabad department.  Responsibilities include working with US and India teams to perform thermal and structural analysis of high-performance electronic assemblies.  Specific tasks include daily use of thermal and structural analysis software, taking concept layouts from the design team, creating representative analytical models, defining boundary and loading conditions, running simulations, analyzing results, and making recommendations for optimization of designs.  The Sr. Engineer will interface with internal staff and outside partners in the fast-paced execution of a variety of multi-disciplined projects.

Minimum Qualifications:

• Bachelor's OR Master’s degree in Mechanical/Thermal/ Electronic Engineering or a related field.
• 4+ years actively involved in thermal and structural engineering analysis of high-density electronics packaging.
• Strong background in heat transfer fundamentals with a good understanding of electronics cooling technologies (passive and active).
• Knowledge of packaging technologies, electromechanical design, and thermal management materials.
• Analysis tools experience utilizing Flotherm,XT, Icepak, 6SigmaET, Celsius EC, Ansys, Abaqus, or equiv.
• Experience in forced cooling solutions for chassis / systems & Racks.
• Experience in Analysis for Liquid cooling solutions for systems.
• Desired to have Solid modeling experience utilizing Pro/E or Solidworks mechanical CAD system.
• Proven ability to work independently and collaboratively within a cross-functional team environment.
• Strong technical documentation skills and excellent written and verbal communication.

Minimum Qualifications:

• Bachelor's degree in Mechanical Engineering or related field and 2+ years of Mechanical Engineering or related work experience.
OR
Master's degree in Mechanical Engineering or related field and 1+ year of Mechanical Engineering or related work experience.
OR
PhD in Mechanical Engineering or related field.

Required Skills & Experience

• 5+ years of experience in IP verification for ASIC designs.
• Strong expertise in System Verilog, SVA, UVM, and Verilog.
• Solid understanding of ASIC design flow and design fundamentals.
• Proven experience in testbench architecture, testbench development, test plan creation, and coverage analysis.
• Hands-on experience with latest debug tools and methodologies.
• Knowledge of AI/ML concepts and their application in verification is a strong plus.
• Excellent communication, problem-solving, and documentation skills.
• Protocols – AHB, APB, AXI is a strong plus.

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