System Level Test Engineer, Staff

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

At Qualcomm, we are transforming the automotive industry with our Snapdragon Digital Chassis and building the next generation software defined vehicle (SDV). We allow automakers to deliver connected, intelligent experiences that are safer, customizable, and immersive with new technology features. At core of all this is a Snapdragon high-performance, power efficient SoCs to deliver a comprehensive, cost and energy efficient systems solution. To Test and Productized SoC with highest quality and lowest cost is a unique challenge in its own way and this is where you come in.

The QAM (Qualcomm Automotive Module) test group is responsible for delivering Test solutions for Qualcomm leading-edge Automotive Modules. In this role you will be expected to develop Test solutions including Test plan, Bring up, Test program, Qualification program working with Hardware, Software, System and Design teams. Responsibilities for this position include working with engineering teams for early-stage module bring-up and post-silicon validation efforts, work closely with software teams to evaluate integrated system performance, test, and characterize HW/SW interaction, device performance at various operating conditions (voltage, process and thermal), work with the production test teams to develop system test solution to screen QAM manufacturing issue.

The individual selected for the position, needs to be proactive, able to work in a fast-paced dynamic environment.

 Principal Duties and Responsibilities:

• Evaluates, characterizes, and develops Test solutions for Qualcomm automotive module.

• Interfaces with various cross-functional teams (e.g. Design, Software/System Engineering, Architecture Development, Packaging Team, Business Groups, Customer Engineering) to drive and incorporate the latest test solutions in the production program to improve the yield, test time, and quality.

• Experience in project planning, giving direction to team

• Experience in analyzing specifications, creating test plans and test execution is required.

• Experience in developing test cases for Android/QNX-based devices is required.

• Hands-on debugging/triaging experience on Module level issues using Android debugging tools and/or using JTAG Lauterbach/Trace32 is required.

• Work with team to develop automatic reports, dashboards, and charts to share progress growth with key stack holders.

• Required Logical reasoning and analytical skills to debug failures. Use technical expertise to identify solutions to test failures.

• The candidate is expected to be self-driven to quickly get up to speed on various aspects of test developments & flexible to take up tasks as per the project needs.

• Experience working with Perforce, GIT, or other Source Control SW is required.

• Experience in production testing (Gauge R&R, shop floor) and handling OSATS is required

• Experience on module testing, PCB debugs, SMT issues is required

• Should be comfortable with reading Schematics and layout files of HW systems.

• Good working knowledge of Android Architecture, Android Boot process, Kernel, Core BSP and Android Performance will be plus.

• FA knowledge for driving module debugs is required.

• Good system level understanding of the HW platforms having various peripherals like DDR, UFS, USB, Display, Camera, Power management IC is preferred.

• Understanding of Module assembly, Boundary scan test and assembly defects will be plus.

• Experience in Python, C#, .NET Framework, C/C++, Perl is a plus.

• Working knowledge of system level benchmarks (e.g. like Dhrystone, AnTuTu, Monkey Test) will be a plus.

Preferred qualification:

• Minimum 8+ years of experience

• Able to lead a team of 5+

• Experience in Module/System in Package/Board product testing at NPI or HVM. Experience with automotive product is a plus.

• Rich Hands-on System/SW/bench test/ HW-SW interaction test experience, preferably in the Automotive/mobile devices/microprocessor industry.

• Highly motivated, fast learner, team player with good communication skills.

• Education: Master’s degree in Electrical Engineering, Electronics and Communication and Computer Science engineering.

• Good in Korean will be a plus.

Minimum Qualifications

• Minimum 8+ years of experience

• Experience in Module/System in Package/Board product testing at NPI or HVM.

• Education: Bachelor’s degree in Electrical Engineering or Electronics and communication or Computer Science engineering or Information systems.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

Applicants: If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport 

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

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If you would like more information about this role, please contact Qualcomm Careers.