Senior Mechanical Engineer – AR / XR

Location: Hsinchu City, Hsinchu City, Taiwan

Department: Mechanical Engineering

Work Location: onsite

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > Mechanical Engineering

General Summary:

Job Overview

The candidate will be working directly for Qualcomm as a Sr mechanical engineer developing PCB-based electromechanical assembly designs across test and form factor accurate reference designs.

Responsibilities include:

• Styling realistic ID driven AR glass designs for studies and customer driven devices.
• Creating and releasing 3D CAD designs and documentation
• Electromechanical layout & enclosure design of test platforms.
• Creating, sourcing, and sustaining mechanical assembly bill-of-materials.
• Coordinating/sourcing prototype plastic, sheet metal, CNC machined mechanical assembly components including housings / frames, heatsinks, antennas, mounts, chassis, etc.
• Coordinating with suppliers, sourcing, and manufacturing staff to facilitate initial prototype and production builds.
• Communicate and collaborate effectively with multi-disciplinary team members in various geographical regions.
• Develop basic thermal & structural analysis models of mechanical assemblies.
• Effectively communicate and collaborate with multi-disciplinary teams across various geographical regions.
• Full time 5days / week onsite presence needed.

Engineer will interface with internal staff and outside suppliers in the fast-paced execution of a wide variety of multi-disciplined design projects.

Minimum Qualifications

• BSME or equiv from accredited college

Preferred Qualifications

• Strong understanding of mechanical engineering product design fundamentals

• 3+ years epx working on HMD, AR glasses or equivalent EM packaging mechanical designs.
• 3+ 3D solid modelling design tools experience utilizing CREO, Solid works or equivalent platform.
• 3+ year design experience with plastic injection molded, die cast, formed sheet metal, and machined parts.
• 3+ year experience working on mechanical constraints for printed circuit boards designed in a packaged housing/test platform.
• 3+ years exp with FPC layout designs for manufacture.
• 1+ years experience using 3D thermal analysis software like Flowtherm or Icepak.
• 1+ years experience with structural analysis FEA tools.
• Stack up tolerance analysis of complex design systems.
• Basic understanding of antenna design, RF, thermal and industrial design constraint requirements for AR/XR form-factor designs. 
• Strong written and verbal communication skills.

Additional Skills

• Top-down solid modelling experience with 3D design databases.
• Design constraint (EMN file) transfer experience between 3D CAD and PCB electronic CAD designs.
• Test/assembly fixture design experience
• Experience with PDM systems (Agile preferred) for BOM and project management.

Education Requirements

BSME (Bachelors – Mechanical Engineering) required

Minimum Qualifications:

• Bachelor's degree in Mechanical Engineering or related field and 2+ years of Mechanical Engineering or related work experience.
OR
Master's degree in Mechanical Engineering or related field and 1+ year of Mechanical Engineering or related work experience.
OR
PhD in Mechanical Engineering or related field.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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