Semiconductor Packaging Process Engineer, Up to Staff

Location: Hsinchu City, Hsinchu City, Taiwan

Department: Packaging Engineering

Work Location: onsite

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

 

General Summary:

Qualcomm Packaging group is responsible for developing new package technologies and high volume manufacturing deployment for different product segments for mobile market & new emerging markets. This team is responsible for road mapping, working with OSATs, suppliers, internal design and cross-functional teams. Team is looking for experienced packaging engineer who has developed various packaging technologies Flipchip, CSP (Chip-Scale Package), PoP (Package-on-Package), SiP (System in Package), Module package. etc. Some management and integration lead experience will be a plus.

·       Responsible for exploring, development and HVM deployment of FCCSP, PoP and/or SiP/Module and Memory packaging technologies.

·       Responsible for initiating & defining package process flow, material set/ BKM, test vehicle, DOEs & cornering, process control plans to successfully develop manufacturable and reliable products.

·       Interface with OSATs, substrate/ material suppliers, and tool makers in developing technology related to product requirements. Align with internal product teams on Design Rule and its establishment.

·       Associate with internal design team and drive DFM methodology for new technologies.

·       Work with internal design, modeling and procurement teams to implement technically best and lowest cost packaging.

·       Technical program management to plan, execute, and monitor complex processes or product developments. Regular updates on program status to management and share with cross team members.

·       Good knowledge and understanding of SPC/QC concepts, failure mechanism and failure analysis process techniques, manufacturing floor operations and Quality issue handling.

Minimum Qualifications

·       5+ years of experience in IC packaging as a Process Development or Process Integration Engineer

·       Proven expertise in IC package development for FC-CSP, FC-BGA, PoP, SiP/module, and/or Memory packaging processes.

·       Hands-on experience with IC package assembly processes, including Die Preparation, Flip-Chip Attach, Underfill, Molding, SMT, and other key packaging processes and material technologies.

·       Strong knowledge of IC package substrates is a plus.

·       Strong understanding of failure mechanisms and proficiency in failure analysis techniques.

·       Willingness to travel frequently and collaborate with OSATs, equipment vendors, and material suppliers.

 

Preferred Qualifications

·       Experience in working with OSATs or major foundry packaging teams.

·       Hands-on process experience in IC package assembly process development.

·       Experience with packaging assembly manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component, component & board level reliability testing.

·       Good understanding in CPI (Chip Package Interaction) and package reliability.

 

Educational Requirements

·       Required: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related degree or equivalent practical experience.

·       Preferred: Master's degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related Engineering field.

Minimum Qualifications:

•    Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [email protected] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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