Package/System Design Engineer (PMIC SIP and Module)

Location: Hsinchu City, Taiwan

Department: Packaging Engineering

Work Location: onsite

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

The IC Package System Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc...).

Responsibilities

• Experience in board level system design, schematic drawing, component selection, performance optimization and verification.

• IC top level floorplanning including hard macro block placement, padring, RDL and bump pattern/assignment

• System level co-design methodology of IC, Package and PCB/Board

• Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost

• Package design flow methodology implementing high speed interface SI constraints for impedance, IR drop, cross-talk. And RF. And RF constraints for impedance matching, coupling, desense.

• Package design flow methodology implementing power distribution network (PDN) constraints for high frequency processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels

• Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products

Minimum Qualifications

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
• 2+ years Hardware Engineering experience or related work experience.

Preferred Qualifications

• Experience in IC package and/or PCB selection , design , and layout experience - Experience in Pinmap optimization of optimal PCB design
• Strong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory
• Working knowledge of die floor planning, IO placement, and bump placement
• Working knowledge of Chip, Package and PCB co-design methodology
• Familiar with assembly and substrate manufacturing process
• Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
• Familiar with PCB stack-up and breakout strategy

Educational Requirements

• Bachelor's Electrical Engineering and/or Mechanical Engineering.
• Preferred: Master's, Electrical Engineering.

Minimum Qualifications:

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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