Heterogeneous Integration Physical Design Engineer

Location: Hsinchu City, Taiwan

Department: ASICS Engineering

Work Location: onsite

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives communication and data processing transformation to help create a smarter, connected future for all. As a Qualcomm ASIC Engineer, you will define, model, design (digital and/or analog), optimize, verify, validate, implement, and document IP (block/SoC) development for a variety of high performance, high quality, low power world class products. Qualcomm Engineers collaborate with cross-functional groups to determine product execution path.

Key responsibilities:

• • Drive PPAC assessment and technology pathfinding for System-Technology Co-Optimization (STCO) and heterogeneous integration.
  • Evaluate and develop 2.5D/3D chiplet integration solutions, including SoIC, CoWoS, WoW, hybrid bonding, interposer, and RDL technologies.
  • Perform custom DRAM and 3D SRAM integration evaluation and pathfinding for advanced product development.
  • Develop and support test-chip design, mask layout, design flows, and PDK enablement for advanced silicon and packaging technologies.
  • Perform layout and design analysis for advanced technology benchmarking, DFM, and product issue debugging.
  • Develop and assess advanced system PDN solutions and system-level KPIs.
  • Serve as a technical interface with foundries, supporting technology evaluation, design enablement, and STCO activities.

Desired Skillset / Experience

• • Strong experience in 2.5D/3D heterogeneous integration, STCO, and technology pathfinding.
  • Hands-on experience with physical design and custom layout in advanced silicon technologies, preferably sub-10nm.
  • Experience with heterogeneous integration technologies such as hybrid bonding, wafer bonding, TSV, micro-bump/u-bump, RDL, and backside metallization.
  • Experience with TSMC SoIC and/or CoWoS product or technology development is highly desirable.
  • Hands-on experience with PDK development and verification flows, including DRC, LVS, PEX, and DFM.
  • Proficiency with Calibre, Cadence, SVRF, TCL, and related scripting/design automation.
  • Experience in test-chip design, mask layout, tapeout, and silicon execution.
  • Experience with technology benchmarking and PPAC assessment for advanced technology nodes.
  • Knowledge of system PDN, Power Integrity (PI), and Signal Integrity (SI) is a plus.
  • Experience with process integration and/or unit process development is highly desirable.
  • Experience with 3D cache/SRAM architecture and partitioning is a plus.

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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