Chiplet Integration Process Engineer, up to Sr. Staff

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.

Job Role

Drive Process Technology evaluation, development and execution for Qualcomm’s multi-chip integration through advanced bonding and interconnect technologies.

Responsibilities:

Candidate will help define, evaluate, and develop diverse chiplet integration schemes using advanced bonding techniques utilizing appropriate interconnect schemes. Candidate will collaborate with Qualcomm internal and Foundry teams, including Design and Package teams, to develop and propagate these Chiplet solutions while meeting key product specifications. Candidate must possess expert knowledge of advanced process technology details driving industry-wide chiplet integration schemes including Wafer-on-Wafer bonding, Chip-on-Wafer 3D Bonding, Hybrid Cu[1]Cu Bonding. Experience in Chiplet integration schemes and related thermal, electrical, and mechanical trade-offs is a requirement. Good communication skills as well as the ability to work in a geographically diverse team environment are essential.

Basic Qualifications: >5years of experience in evaluating and developing multi-chip integration schemes through advanced bonding technologies.

Education: Master's (Electrical Engineering, Materials Science or related field) required. Bachelor’s with 3+ years additional experience may be considered.

Preferred Qualifications/Knowledge: RTL to GDS design flow and EDA Tool dependencies 3DIC Design Flows Experience in Mentor / Cadence tools for layout generation.

Key Words 3DIC, Hybrid Bonding, Wafer-on-Wafer Bonding, WoW Bonding, Chiplets, Cu Bonding, TSV

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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