Senior Electro-Optic Packaging Engineer (Experimental)

We believe quantum computing will change everything.  It will have the power to transform the foundations of giant industries that rely on intensive computation.  PsiQuantum is on a mission to build the world’s first useful quantum computer, capable of delivering these transformative results.  We know that means it will need 1 million qubits, error correction, a scalable architecture and a data center footprint.

By harnessing the laws of quantum physics, quantum computers can provide exponential performance increases over today’s most powerful supercomputers, offering the potential for extraordinary advances across a broad range of industries including climate, energy, healthcare, pharmaceuticals, finance, agriculture, transportation, materials design, and many more. 

PsiQuantum is uniquely positioned to deliver on the promise of quantum computing years earlier than our competitors. Our architecture is based on photonics which gives us the ability to produce our components using existing high-volume semiconductor manufacturing processes, the same processes that are today producing billions of chips for telecom and consumer electronics applications. Since photons don’t feel heat, we can take advantage of existing cryogenic cooling systems, the kind that have been operating at facilities like the Stanford Linear Accelerator (SLAC).  And because photons are in fact light, they can move between subsystems at tremendous speed using standard fiber connectivity.

Our team is building a utility scale quantum computer and the software tools needed to build fault tolerant quantum applications. We’re a highly motivated and collaborative group focused on a singular goal - building the world’s first useful quantum computer on the fastest path possible. 

There’s much more work to be done and we are looking for exceptional talent to join us on this extraordinary journey! 

Job Summary:

The Senior Electro-Optic Packaging Engineer (Experimental) will lead the evaluation of electro-optical package design options through advanced experimental methodologies. This role involves partnering with Package design engineers and FEA engineers to guide and validate packaging designs thru experimental means. The engineer will also collaborate with package assembly process development teams to minimize the impact of assembly processes on PIC/EIC integrity, employing tools such as DOE, statistical analysis, and process monitoring techniques.

The engineer will be responsible for conducting failure analysis, material characterization, and experimental investigations to address key failure modes and assess risk. Designing and operating experimental instrumentation, data acquisition systems, and sensors for thermal, mechanical, and optical measurements, including those under vacuum and cryogenic conditions. The role also involves partnering with FEA engineers to integrate experimental findings with numerical simulations, driving a comprehensive understanding of package performance and reliability.

Responsibilities:

• Interpret optical, thermal, electrical, and mechanical requirements for electro-optical packaging and evaluate design options using experimental tools.
• Guide assembly process development to minimize its impact on PIC/EIC integrity, ensuring alignment with performance requirements.
• Develop inline metrologies for process stability monitoring
• Design and conduct experiments using DOE, and statistical analysis techniques to validate package designs.
• Perform failure analysis using advanced tools and methodologies to identify and mitigate key failure modes.
• Characterize packaging materials to support the development of numerical material models, including time/temperature dependent responses.
• Develop and utilize experimental instrumentation and data acquisition systems, including sensors for thermal, mechanical, and optical measurements under vacuum and cryogenic environments.
• Conduct reliability testing, root cause analysis, and corrective actions for process or field failures.
• Partner with FEA engineers to complement numerical investigations with experimental insights for thermo-mechanical and electro-optical studies.
• Collaborate with cross-functional teams to integrate experimental findings into package design improvements and process optimizations.

Experience/Qualifications:

• Strong expertise in experimental tools and techniques for evaluating optical, thermal, electrical, and mechanical behaviour of Electro-optic assemblies.
• Familiarity with DOE, statistical analysis tools, measurement capability analysis, and process monitoring techniques.
• Experience with advanced failure analysis methods and tools, including root cause analysis and corrective actions.
• Knowledge of package architectures, assembly materials, and associated failure modes, with hands-on experience in creating risk mitigation plans through experimental investigation.
• Proficiency with experimental instrumentation, data acquisition systems, and sensors, including their operation under vacuum and cryogenic conditions.
• Knowledge of material testing and characterization, including time/temperature dependent behavior of packaging materials.
• Experience in reliability testing, lifecycle analysis, and failure investigations for packaging solutions.
• Familiarity with numerical simulation tools and the ability to collaborate effectively with FEA engineers.
• Engineering degree in Mechanical, Electrical, Materials Science, or related fields (BSc with 6+ years of experience, MSc with 3+ years, or PhD).

PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.

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