Quantum computing holds the promise of humanity’s mastery over the natural world, but only if we can build a real quantum computer. PsiQuantum is on a mission to build the first real, useful quantum computers, capable of delivering the world-changing applications that the technology has long promised. We know that means we will need to build a system with roughly 1 million qubits that supports fault tolerant error correction within a scalable architecture, and a data center footprint.
By harnessing the laws of quantum physics, quantum computers can provide exponential performance increases over today’s most powerful supercomputers, offering the potential for extraordinary advances across a broad range of industries including climate, energy, healthcare, pharmaceuticals, finance, agriculture, transportation, materials design, and many more.
PsiQuantum has determined the fastest path to delivering a useful quantum computer, years earlier than the rest of the industry. Our architecture is based on silicon photonics which gives us the ability to produce our components at Tier-1 semiconductor fabs such as GlobalFoundries where we leverage high-volume semiconductor manufacturing processes, the same processes that are already producing billions of chips for telecom and consumer electronics applications. We also benefit from the quantum mechanics reality that photons don’t feel heat or electromagnetic interference, allowing us to take advantage of existing cryogenic cooling systems and industry standard fiber connectivity.
In 2024, PsiQuantum announced two government-funded projects to support the build-out of our first Quantum Data Centers and utility-scale quantum computers in Brisbane, Australia and Chicago, Illinois. Both projects are backed by nations that understand quantum computing’s potential impact and the need to scale this technology to unlock that potential. And we won’t just be building the hardware, but also the fault tolerant quantum applications that will provide industry-transforming results.
Quantum computing is not just an evolution of the decades-old advancement in compute power. It provides the key to mastering our future, not merely discovering it. The potential is enormous, and we have the plan to make it real. Come join us.
There’s much more work to be done and we are looking for exceptional talent to join us on this extraordinary journey!
Job Summary:
The Electro-Optic Assembly Process Engineer will lead the development and optimization of assembly processes for advanced electro-optic packages. This role involves close collaboration with electro-optic package design, optical packaging, and EIC packaging teams to ensure manufacturability (DFM) and compliance with assembly process design rules. The engineer will develop and characterize assembly processes, create work instructions, and monitor process capability and stability. Key areas of focus include establishing defect libraries, conducting PFMEAs, implementing risk mitigation plans, and enhancing design flexibility through process design rule improvements.
The engineer will also assess the impact of assembly processes on PIC/EIC performance, influence BOM selection, optimize material handling, and design fixturing tools to support complex subassemblies. This position requires collaboration with operations teams to define and select process equipment, create related process recipes, and train engineers and technicians. Additionally, the role involves driving root cause analysis for yield losses or failures in manufacturing, qualification, or field operations, and implementing continuous improvement activities to meet production and quality goals.
Responsibilities:
- Design, develop, and optimize assembly processes for electro-optic packages, ensuring DFM and adherence to design rules.
- Collaborate with internal teams and external OSATs to enhance assembly process capabilities and flexibility.
- Prepare detailed work instructions, perform process characterization, and define success criteria for assembly processes.
- Establish and maintain a defect library, defining specifications to mitigate assembly-related failures.
- Conduct PFMEA, identify key risks, and implement effective mitigation strategies.
- Develop and deploy process monitoring methodologies, including measurement capability analysis.
- Characterize the impact of assembly processes on PIC/EIC performance and optimize processes to enhance system reliability and yield.
- Influence design and BOM selection decisions based on process capabilities and reliability expectations.
- Coordinate material handling and filtering tool designs to support complex subassembly assembly processes.
- Collaborate with operations and OSATs to align process improvements with production requirements.
- Partner with operations teams to define process equipment requirements, support selection and acquisition, and create process recipes.
- Train operations engineers and technicians to ensure smooth process transfer and readiness for production.
- Drive root cause analysis for yield loss and failures during manufacturing, qualification, or field use.
- Own and execute continuous improvement activities to enhance process performance, stability, and yield.
Experience/Qualifications:
- Hands-on experience with assembly processes such as die attach, wire bonding, optical coupling, underfill, fiber attachment, substrate handling, and advanced material handling.
- Proficiency in process characterization, process monitoring, and statistical process control (SPC) and metrology development, including measurement capability analysis techniques.
- Strong knowledge of PFMEA and risk mitigation methodologies.
- Familiarity with the interaction between assembly processes and PIC/EIC performance.
- Experience designing fixtures and handling tools for complex subassemblies.
- Strong skills in equipment specification, selection, and recipe development for assembly processes.
- Proven ability to lead root cause analysis and implement corrective actions for yield and quality improvements.
- Bachelor’s degree in Mechanical, Materials, Electrical Engineering, or a related field with 6+ years of experience; Master’s degree with 3+ years; or a Ph.D.
PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.
Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to recruiting@psiquantum.com.
We are not accepting unsolicited resumes from employment agencies.
The range below reflects the minimum and maximum target range for new hire base salary across all US locations. Actual compensation may vary outside of this range and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs. Base pay is only one part of the total compensation package. Full time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future.
For a fully qualified candidate, the expected base pay range is:
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