PROCESS ENGINEER
Location: Bangkok
Time Type: Full time
Job Description
Job Duties:
- Own and sustain Die Attach processes, including parameter control, material management, and process stability
- Monitor daily performance, yield, scrap and drive corrective actions when deviations occur
- Lead structured problem-solving for issues such as die tilt, epoxy flow, voids, curing issues, glue discoloration, and material variation
- Support NPI activities: DOE, machine capability studies, qualification runs, documentation, and customer audits
- Optimize processes for yield improvement, cost reduction, cycle time reduction, and equipment efficiency
- Collaborate closely with Production, Equipment Engineering, QA, PE, and suppliers to resolve issues and implement improvements
- Evaluate and qualify materials (epoxies/glue), tools (nozzles, collets), and die bonding equipment
- Maintain and update engineering documents (WI, OCAP, FMEA, Control Plan, parameter specification)
- Ensure safety, quality, and process compliance according to company standards
Job Requirement :
- Bachelor’s or Master’s degree in Electronics, Electrical, Mechanical, Materials Engineering, or related field.
- 2+ years of experience in Die / Component Attach & Cure processes or related assembly/front‑end semiconductor processes.
- Strong background in process sustaining, yield improvement, and defect reduction in high‑volume manufacturing FMEA and Control plan.
- Demonstrated capability in process change management, including risk assessment, qualification, and controlled implementation across manufacturing sites.
- Strong collaboration skills working with global teams, suppliers, and cross‑functional partners.
- Excellent communication and presentation skills for technical and management audiences.
- Self‑driven, disciplined, and capable of working independently with strong ownership.
- Proficient in Microsoft Office tools for analysis, reporting, and presentations
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