Principal SoC Chip Lead

Location: Shanghai (Pudong), Tianjin (Teda)

Time Type: Full time

Job Description

Responsibilities:

• End-to-End Project Ownership: Own SoC program execution from project definition through tape-out and post-silicon support. Ensure on-time, high-quality delivery of key milestones and coordinate engineering support during silicon bring-up, validation, and debug.
• Technical Leadership: Drive technical decision-making across architecture, integration, verification, implementation, validation, and system teams. Serve as the overall technical execution owner for assigned projects.
• Cross-Functional Coordination: Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams. Resolve technical dependencies, execution bottlenecks, and critical project risks.
• Program Execution & Risk Management: Develop and maintain project execution plans together with PMO and SoC PM. Monitor schedule, resource demand, critical paths, and risk mitigation plans; drive recovery actions when milestones are at risk.
• Stakeholder Management: Partner with Product Marketing, System Architecture, System Engineering, NPI PM, BU management, and external stakeholders. Communicate project status, technical readiness, key risks, and mitigation plans during management and milestone reviews.
• Tape-Out & Silicon Readiness: Own overall tape-out readiness, including integration quality, signoff closure, cross-functional alignment, and risk management. Coordinate post-silicon validation activities and engineering resources to support silicon bring-up and issue resolution.

Requirements:

• Bachelor's degree or higher in Microelectronics, Electrical Engineering, or related disciplines.
• 6+ years of semiconductor industry experience.
• Proven experience in SoC development from architecture through tape-out.
• Strong understanding of SoC development flows including: Architecture, RTL Design, Integration, Verification, DFT, Emulation, Physical Design, Silicon Validation.
• Experience leading large cross-functional engineering teams.
• Strong project execution, planning, and risk management skills.
• Excellent communication, leadership, and stakeholder management capabilities.
• Ability to influence technical direction and drive execution in a matrix organization.

Preferred Qualifications:

• Previous experience as: Chip Lead / SoC Technical Lead / Chief Engineer / Project Technical Leader
• Experience with automotive, industrial, or safety-critical semiconductor products.
• Experience working with global development teams across multiple sites.
• Successful delivery of multiple SoC tape-outs and post-silicon product ramps.

Core Competencies:

• Technical Leadership
• Cross-functional Collaboration
• Project Execution Excellence
• Risk Management
• Strategic Thinking
• Problem Solving & Decision Making
• Stakeholder Management
• Communication & Influence
• Customer Focus
• Results Orientation

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