Engineer/Principal Engineer Digital-RF Subsystems I&T

Location: United States-Maryland-Baltimore

Time Type: Full time

Job Description

RELOCATION ASSISTANCE: Relocation assistance may be available

CLEARANCE REQUIRED FOR START: Yes

CLEARANCE TYPE: Secret

TRAVEL: Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

The AMS E&S organization at Northrop Grumman Missions Systems in Baltimore, Maryland is seeking Digital-RF subsystems integration and test engineers for individual contributor roles supporting subsystem development, controls integration, and verification activities.

This role is focused on digital and RF subsystem integration and test with a strong emphasis on controls integration spanning FPGA and embedded software implementation on system-on-chip FPGA platforms. Work is performed with general direction from technical leads while exercising sound engineering judgment in executing assigned objectives and solving technical problems.

The qualified candidates will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program. Applicants should possess the ability to communicate effectively and clearly present technical approaches and findings.

Responsibilities may include:

• Integration of Digital-RF subsystem hardware and representative lab test environments
• Integration of new equipment and programs in a state-of-the-art facility
• Software development for automating test processes, controls verification, and data analysis
• Troubleshooting digital, embedded software, FPGA, and RF issues during subsystem integration and test
• Analyzing test data and identifying early trends
• Supporting program meetings in developing root cause and corrective actions
• Collaborating with design engineering for hardware, controls, firmware, embedded software, and test improvements

• Subsystem analysis including digital architecture, signal paths, and hardware interfaces from RF front end through digital processing
• Support for performance testing, requirements verification, and more.

In addition, this candidate should have demonstrated technical ability and expertise in one or more of the following areas:

• Digital-RF subsystem integration, test, and system integration
• System-on-chip FPGA integration and bring-up
• Embedded software and controls integration for hardware platforms
• Development and verification of subsystem controls across hardware, firmware, and software boundaries
• Highly integrated digital-RF subsystems and antenna hardware for active electronically scanned array (AESA) systems
• Electronic warfare, radar, communications, or related mission-system principles and their system applications
• Comfortable creating test support applications and tools using MATLAB, Python, or similar technical computing tools
• Conducting Test Readiness Reviews and/or Design Readiness Reviews

• Concept of operations development for integration and test activities
• Executing subsystem and system level testing – both in engineering development and manufacturing environments

These roles are contingent upon candidates having a current, active government Secret Clearance.

These roles are contingent upon Program Award.

This is a Dual-level opening, candidates will be considered at both a level 2 (Engineer) or 3 (Principal Engineer) based upon the Basic Qualifications listed below.

Basic Qualification - Engineer Digital-RF Subsystems Integration & Test:

• Must hold a Secret or Top-Secret security clearance
• Must have a Bachelor's Degree in Engineering or related discipline with 2 years of experience in the areas described in the job description or Master's Degree with 0 years of experience. An additional 4 years of experience is acceptable in lieu of degree.
• Experience using MATLAB, Python, or similar engineering analysis tools
• Experience with digital and/or RF subsystem integration and test or design
• Experience supporting hardware bring-up, verification, or troubleshooting activities

Basic Qualification - Principal Digital-RF Subsystems Integration & Test Engineer:

• Must hold a Secret or Top-Secret security clearance
• Must have a Bachelor's Degree in Engineering or related discipline with 5 years of experience in the areas described in the job description or Master's Degree with 3 years of experience or PhD with 0 years of experience. An additional 4 years' experience is acceptable in lieu of degree.
• Experience using MATLAB, Python, or similar engineering analysis tools
• Experience with digital and/or RF subsystem integration and test or design
• Experience supporting hardware bring-up, verification, or troubleshooting activities
• Experience integrating or troubleshooting FPGA, embedded software, or system-on-chip FPGA-based hardware

Preferred Qualifications:

• TS/SCI clearance
• SAP clearance

Strong knowledge of:

• Setting up lab, system integration, and Digital-RF hardware test environments

• Control architectures and controls integration for hardware with firmware, embedded software, and system-on-chip FPGAs

Knowledge of:

• RF and antenna theory, including RF performance analysis
• Python
• VHDL/Verilog
• C/C++
• Test development experience for lab test environments and subsystem hardware
• Experience troubleshooting digital-RF subsystems
• Understanding of digital signal processing chains
• Experience working with and supporting engineers across firmware, software, power, and RF test teams

Primary Level Salary Range: $96,300.00 - $144,500.00

Secondary Level Salary Range: $119,600.00 - $179,400.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.