High-Speed Package Design Engineer

Location: United States

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.

This role focuses on end-to-end package design ownership, including architecture definition, SI/PI analysis, electromagnetic modeling, and measurement correlation, while working closely with silicon, PCB, and system integration teams. The successful candidate will also contribute to package design enablement through ADKs and reusable libraries, in close collaboration with leading EDA vendors. Package and system design leadership is the primary emphasis of this role.

This position is suitable for senior-level engineers who are comfortable taking ownership of complex package designs while influencing broader design flows and infrastructure.

At Nokia Bell Labs, we invent the future of communications. Our research and development teams create technologies that power next-generation wireless, optical, and system-level platforms. We are seeking highly motivated engineers to contribute to advanced hardware innovation at the intersection of silicon, packaging, and systems.