What will your job look like
- Work closely with the design teams from early stages of the design process to review DFX architecture and define test requirements.
- Define test methodologies and generate test content for high-speed interfaces of embedded IP blocks (LPDDR4/5, PCIe Gen4/5, D/C/MPHY).
- Test program coding, pattern conversion and pre-Si validation (virtual test simulations).
- Support Load Board and Probe Card design activities.
- Lead post-Si test program debug activities to enable delivery of samples to internal and external customers.
- Test program characterization and tuning to enhance test program quality to meet automotive standards.
- Support Quality & Reliability team to enable effective and timely qual plan execution.
- Lead test deployment activities with tier-one Foundry and OSAT vendors to enable large-scale Wafer-Sort and Final-Test operations.
All you need is:
- BSc or MSc degree in Electrical Engineering.
- 7+ years of experience as IC Product/Test engineer.
- Hands on experience in bring-up & productization of complex IC products.
- Prior experience with Teradyne UltraFlex/UltraFlexPlus is - significant advantage.
- Deep understanding of structural DFT methods (scan, mbist, jtag, …).
- Proficiency in C/C++ and scripting language (Perl, Python, …) in Unix environment.
- Experience with data and yield analysis using known statistical methods and tools (e.g. JMP).
- Familiarity with Verilog and RTL behavioral simulations – an advantage
- Strong sense of ownership, commitment, and responsibility.
- Team player, with the ability to work in a rapidly evolving environment.
- Good interpersonal communication skills.

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