Senior Director Hardware Engineer

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate, high-energy engineers to help achieve that mission.  

As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. We are looking for seasoned engineering leaders with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.   

We are looking for a Senior Director Hardware Engineer to work in the dynamic Microsoft Silicon Manufacturing Packaging Engineering team (SMPE). 

Required/Minimum Qualifications 

• 11+ years of related technical engineering experience
  • OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience or internship experience
  • OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience or internship experience
  • OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience.
• 10+ years of experience in Product development and manufacturing in large scale and/or high performance (i.e., AI, machine leaning, neural nets, CPU’s) and/or high power SoCs/chips.   
• 10+ years of experience in Developing Integrated Circuits (pre-silicon, first silicon bring-up, new product introduction).   
• 8+ years of experience in product and test engineering, specializing in ATE test program development.   

Other Requirements  

• Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter. 

Preferred Qualifications   

• Lead by effectively managing external vendors, guiding cross-functional teams, and overseeing sub-projects within larger development programs. 
• The position requires experience in semiconductor IC development, IC manufacturing, fabrication, testing, and packaging. 
• They should also have excellent knowledge of manufacturing development across foundry, packaging integration, assembly, test, characterization, debug, and yield disciplines. 
• The candidate should also have knowledge of design and pre-silicon development and what is required to ensure manufacturability to deliver a high volume ramp -  DFT, test coverage, quality/reliability. 
• The candidate would benefit from a background in various product market areas such as high-performance computing, AI, GPUs, CPUs. 
• Overall product engineering role taking product from definition to launch.   
• Experience in platform engineering, gathering customer requirements and shaping solutions that take full advantage of in-house silicon development.   
• Deep understanding of Si configuration (SKU) management, platform dependencies and supplier/customer interfacing   
• Electrical Engineering and/or Device physics background.   

• Expertise in Silicon ingredients, with a focus on evaluation and selection tied to platform architecture decisions

• Industry competitive analysis to drive cost effective product

Silicon Engineering IC6 - The typical base pay range for this role across the U.S. is USD $161,600 - $286,200 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $209,600 - $314,400 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay

Microsoft will accept applications for the role until December 2, 2024.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances.  We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form.

Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.

#SCHIE #AHSI

• Drive next generation manufacturing development roadmaps to enable development, manufacturing, fabrication, testing, and packaging of Hyperscaler class semiconductor integrated circuits (ICs). 
• Work with diverse and talented set of engineering teams to develop the vision for next generation of Hyperscaler class semiconductor integrated circuits (ICs) and how to make them manufacturable with industry leading product cost to provide best in class platform cost of ownership. 
• Drive eco system partnerships to enable pre-Si and post-Si readiness for power, performance, Thermal and Power delivery related testing for industry best platform solutions – differentiating features that will provide cost and performance advantage.   
• Establish and grow external vendor relationships, drive cross functional teams and drive projects as part of larger development programs.   
• Have excellent knowledge of silicon development life cycle across foundry, packaging integration, assembly and test technologies with ability to cultivate industry partnerships to drive outcomes.
• Conduct industry competitive analysis to identify opportunities for developing cost-effective products.