Principal Engineer - Mechanical

Location: India - Bangalore

Time Type: Full time

Job Description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Visit our careers page to see what exciting opportunities and company perks await!

Job Description:

As a Principal Mechanical Engineer you will be responsible for working through all phases of mechanical and thermal development for
Microchip HW solution cards. The designs will include plastic and metal parts, heat sink assemblies, product cases, brackets and stiffeners
for PCIe, U.2 and EDSFF form factor cards as well as customer custom mechanic requirements. You will also be required to design and
execute mechanical and thermal testing for production launch.
The products are cards based on Microchip developed ASICs and are primarily intended to be used in Storage Applications but can span
several vertical markets. A successful candidate will be a key player in the advancement of Microchip’s strategic product direction. The ideal
candidate must have excellent technical skills and excellent time management skills.

Requirements/Qualifications:

Principal Mechanical Engineer Roles and Responsibilities:
• Experience in design of heat sinks and cases. Experience in design for storage applications is an advantage.
• Collaborating with EE to design PCBA’s
• Shock and vibration simulation of PCBAs (ANSYS), CFD simulations of PCBAs (FLOTherm, thermal management)
• Create 3D CAD drawings (Solidworks). Generating PCBA 3D CAD from ECAD models, designing on-board components
• Design plastic and metal parts - Plastic and metal component holders, heat sink assemblies, brackets, stiffeners.
• DFM (design for manufacturing) - injection molding, CNC, stamping, die-casting, extrusion, die-cutting.
• Quick turn prototyping for fit, form testing (3D printing, CNC etc)
• Identifying vendors, working with vendors in ASIA for FAI, DFM and trouble-shooting assembly, manufacturing issues
• Product testing – develop SOPs for thermal, shock and vibe testing both in-house and at external lab partners
• Cross-functional collaboration across EE, supply chain, PMO, testing, customer, ops
• Data presentation to external customers
• Perform basic EE functionality tests on PCBAs
• Key interface between Program management and Operations team executing the mechanical parts for builds.
• Support operations production failures.
• Design test setup for thermal validation test
• Collaboration with HW and operation team members to achieve optimal solution for thermal and cost considerations.
Required Qualifications:
• Good technical skills.
• Bachelor's degree in Mechanical Engineering .
• 5+ years industry related experience.
• Excellent teamwork and time management skills.
• Excellent verbal and written communication skills in English.
• Deep knowledge and experience in heat sink and cases design for production.
Preferred Qualifications
• 5+ years storage industry experience
• Experience in thermal design and finding effective cooling solutions for small form factor solution cards.
• Excellent oral/written communication, interpersonal, and analytical skills.
• Outstanding organizational, prioritization, and multitasking skills.

Travel Time:

To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.