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Packaging Design and SI/PI Engineer

Lyte

Bucharest, Romania
Full-time
Salary not listedPosted 1mo ago

Real job — pulled straight from Lyte’s careers page · Verified July 21, 2026 · No reposts.

Job description

Lyte is hiring a Packaging Design and SI/PI Engineer — a full-time, based in Bucharest, Romania role. Apply directly on Lyte's careers page below.

Packaging Design and SI/PI Engineer

Location: Bucharest, Romania; Taiwan; Singapore

Department: Silicon

About the role

  • We are seeking a middle to senior level packaging design and signal/power integrity Engineer with degree in Electrical Engineering, or a related field.

What you'll do

  • Own the design and layout of our micro-electronic package, the heart of our LyteCore system
  • Collaborate with multi-disciplinary team of engineers (silicon, photonics, system, operations) to define physical and electrical performance specifications for the package
  • Perform signal/power integrity simulation to optimize our package & system performance
  • Work with our substrate/package vendors to ensure design for manufacturability and support delivery of our design on time. Work with said vendors to define high volume price target.
  • Project tracking weekly.
  • Write technical reports and present results.
  • Maintain EDA tools and actively project future needs, including improving design flow definition and recommending EDA envelope.

Required Qualifications

  • Minimal requirement is a bachelor's degree with 5 years of experience
  • Fluent in English communication, able to collaborate with teammates in different time zones
  • Experience in substrate design and packaging technology
  • Experience in signal and power integration simulation and interpretation of the results
  • Experience in EDA tools: Siwave, HFSS, APD, or similar
  • Maintain company confidential information are a must 

Preferred Qualifications

  • Master’s degree with more experience is highly desired
  • Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues
  • Experience with hands-on testing of electronic packages/systems.
  • Knowledge and experience in at least some following processes: device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly. 
  • Experience in other EDA tools such as Altium, Allegro PCB, Spectre, Hspice, Sigrity, ADS.
  • Data analysis experience such as JMPs is a plus; excel is OK.
  • Programming and software maintenance skills are desired eg. python, or C++
  • Describe the experience and attributes of the ideal candidate

Benefits (subject to location and local regulations)

  • Competitive salary and equity 
  • Comprehensive medical, dental, and vision coverage 
  • 401(k) retirement plan 
  • Flexible vacation and time-off policy 
  • Collaborative, fast-paced, and inclusive work environment 
  • Opportunity to work on cutting-edge technologies with a highly cross-functional team 

About the Company

  • About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai


If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!

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Frequently asked questions

How do I apply for Packaging Design and SI/PI Engineer at Lyte?

You can view the full description and apply for Packaging Design and SI/PI Engineer at Lyte on EchoJobs: https://echojobs.io/job/lyte-packaging-design-and-si-pi-engineer-o09nu.