Optical Packaging Engineer

Location: Mountain View, CA

Department: Photonics Packaging Engineering

Job Summary

We are seeking an Optical Packaging Engineer to lead the development of next-generation connectivity solutions. In this role, you will be the bridge between chip design and high-volume manufacturing, driving the optical architecture for Photonic Integrated Circuit (PIC) coupling. You will take ownership of the entire lifecycle from designing custom lenses and detachable Fiber Array Unit (FAU) connectors to managing global OSAT partners for mass production.

If you thrive at the intersection of precision simulation and real-world scalability, this is the role for you.

Responsibilities

• Lead the optical design for PIC-to-PIC and PIC-to-FAU coupling. Design and optimize critical components including Micro-Lens Arrays (MLAs), FAU arrays, and detachable connectors.
• Collaborate on PIC layouts to ensure the chip architecture is optimized for high-efficiency coupling and alignment tolerances.
• Drive the strategy for sub-micron precision alignment both in internal R&D lab and at scale with OSAT partners.
• Establish workflow for Structural, Thermal, and Optical (STOP) analysis. Use these multi-physics insights to predict performance shifts across operating temperatures and mechanical stresses.
• Develop and validate novel optical isolator integration approaches to protect laser sources from back-reflection in high-density PIC environments.
• Lead technical collaboration with OSATs from initial prototyping through validation and into high-volume production (HVM).
• Provide expert guidance on assembly processes to improve throughput, reduce coupling loss, and minimize per-unit costs.
• Partner with electrical, mechanical, and systems teams to ensure seamless product integration and timely delivery of complex modules.
• Distill complex technical findings into clear design concepts and status updates for executive stakeholders and partners.

Required Qualifications

• BS or MS in Optical Engineering, Physics, Mechanical Engineering, or a related field.
• 8-10+ years of hands-on experience in optical or opto-mechanical design, specifically within the photonics or semiconductor industries.
• Proven track record in the design of micro-lenses and FAU arrays in Zemax for PIC-to-PIC and PIC-to-FAU coupling. 
• Hands-on experience with optical alignment and hardware validation.
• Demonstrated experience managing OSATs and suppliers through the full product lifecycle (NPI to high-volume).

Preferred Qualifications

• PhD in Optical Engineering, Physics, Mechanical Engineering, or a related field.
• Familiarity in Lumerical (FDTD/MODE) or similar tools for wave-guide level simulation.
• Hands-on experience with SolidWorks for mechanical integration and connector design.
• Experience with using FEA tools for STOP analysis.
• Expertise in Datacom optical modules and emerging silicon photonics standards.