Lead Technology Development Engineer

Lightmatter builds chips that enable extreme-scale artificial intelligence computing clusters. If you're a collaborative engineer or scientist who has a passion for innovation, solving challenging technical problems and doing impactful work like building the world's first optical computers, consider joining the team at Lightmatter!

We are seeking an experienced and innovative Lead Engineer to spearhead the development of prototyping and validation strategies for our packaging and system technologies. This role is crucial in advancing our laser and photonics packaging technologies, including fiber attach methods. You will lead a team focused on delivering high-impact solutions that set new industry standards and advance Lightmatter’s cutting-edge products for data centers and high-end computing.

Key Responsibilities:

• Formulate and implement strategies to enhance prototyping capabilities for laser and passage packaging technologies, including fiber attach methods.
• Assemble and manage a team of engineers and technicians to develop assembly processes and new concepts for laser and passage technologies.
• Collaborate with Silicon, package, and thermal and mechanical system teams to define and execute a roadmap for in-house capability development, ensuring accelerated prototype turnarounds. Establish the prototype process flow that needs to leverage external capabilities to ensure execution of experimental design is efficient and effective. 
• Negotiate technical requirements and develop specifications in coordination with equipment manufacturers and material vendors.
• Design and set up experiments to validate signal integrity, power integrity, and thermal performance. Manage data collection and analysis to support experimental setups.
• Set up and calibrate lab equipment such as oscilloscopes, spectrum analyzers, thermal cameras, and environmental chambers. Maintain lab equipment and ensure that proper test methodologies are followed
• Maintain and enforce safety standards in the laboratory to ensure a safe working environment and compliance with all relevant regulations.
• Summarize and communicate findings to key stakeholders across Lightmatter, including suppliers and customers, as necessary.
• Generate IPs on packaging, assembly, fiber attach and analytics resulted from experiment and innovation.
• Prepare detailed reports and document methodologies to ensure thorough understanding and knowledge sharing across teams

• MS or PhD in Mechanical Engineering, Material Science, Optical Engineering, or related field.
• 12-15 years of experience in package and system technology development, including managing lab environments and leading teams.
• 3+ years of hands-on experience in thermal, mechanical, signal integrity, and power integrity testing, as well as optical test equipment and analysis in a lab setting.
• Expertise in chip-on-wafer process flow, materials, and equipment.
• Experience designing test chips and assembly test vehicles.
• Knowledge of data center chassis, rack systems, and testing of those systems.
• Proficiency in using lab instruments like oscilloscopes, thermal chambers, TDR equipment, and power analyzers.
• Understanding of photonics packaging requirements and fiber attach methods.
• Experience with 2D/3D packaging technologies and associated thermo-mechanical, PI/SI challenges.
• Experience in thermal, power, or signal integrity test setup and data acquisition. Understanding of optical pathways and components, including transceivers, waveguides, optical fibers, and photonic devices, ensuring minimal signal loss and high-performance

Preferred Qualifications:

• Collaborate effectively in cross-functional teams and communicate technical information with clarity.
• Proficient in data analysis using Python, Excel, or JMP.
• Able to work independently and manage projects with minimal supervision.
• Strong problem-solving skills to quickly address technical challenges.
• Familiar with emerging technologies in thermal management, signal integrity in high-speed communication systems, and power integrity for advanced processors and systems. Understanding of fiber optics, waveguides, photonic devices, and optical transceivers.
• Familiarity with thermal mechanical systems at chassis and rack levels, particularly with OCP V3 racks.
• Experience with design for manufacturability and testability and working with manufacturing teams on design validation and process improvements.