Analog Mixed-Signal Chip Lead Engineer (Boston and Mountain View)

Analog Mixed-Signal Chip Lead Engineer

Lightmatter builds chips that enable extreme-scale artificial intelligence computing clusters. If you're a collaborative engineer or scientist who has a passion for innovation, solving challenging technical problems, and doing impactful work like building the world's first optical computers, consider joining the team at Lightmatter!

In this role, you will be a key member of the analog team architecting the world's first photonic computers. This is fundamentally an interdisciplinary team, and outside-the-box thinking is the daily norm. You will need both deep expertise in mixed-signal and analog design and breadth across other engineering disciplines, such as photonics and digital electronics, semiconductor device physics, thermal/packaging, and machine learning. The successful candidate will demonstrate an eagerness to refresh and grow their competency in these areas.

Responsibilities

• Support micro-architecture development with chip architects by conducting feasibility studies
• Collaborate with members of our design engineering teams (packaging, digital, analog, photonics) to define chip partitions
• Responsible for the top-level design including schematic/layout hierarchy and floor planning
• Work cross-functionally with analog, digital, and photonics block designers to integrate circuit IPs
• Plan for Power Delivery Network (PDN) and support its design implementation
• Plan for ESD strategy and support its design implementation
• Plan for Test strategy and support its design implementation
• Oversee the layout and verify the design to ensure a successful tape-out
• Work with Program Managers to meet the deliverable timelines at various stages in the product development
• Define production and bench-level test plans
• Validate performances of the circuits in the lab

• MS with 8+ years of relevant experience, OR Ph.D. with 5+ years of experience
• Semiconductor industry experience in Analog/Mixed-signal IC design
• Deep understanding of analog and mixed signal circuit design including CMOS device characteristics, noise, mismatch, linearity, and design trade-offs
• Experience leading the design of multiple analog/mixed-signal chips and their tape-outs
• Experience with mixed-signal mode verification methodologies
• Experience with integration flows and their challenges
• Familiarity with packaging effects, supply isolations, ESD structures, and high-frequency circuit layout for optimum performance
• Experience designing chips with 2.5/3D packaging is a plus
• Working knowledge of RTL, PnR, Modeling, and Design verification flows is a plus
• Experience with Cadence Design Environment
• Experience testing analog circuits in a lab environment
• Strong ability to work collaboratively with people across multiple functional areas