Senior Mechanical Engineer - Device Packaging

The salary range for this position is $123,191 - $161,289.

We are looking for a Senior Mechanical Device Packaging Engineer to lead the design, development, and characterization of our current and future trapped-ion package systems, which serve as the heart of IonQ’s quantum computers.  In this role, you will own the drawings and documentation of current ultra-high vacuum packages and lead the development of next generation packages to increase the number of electrical connections, optical access, and thermal stability.  In addition, you will work closely with other quantum system leads to define subsystem interfaces and explore design-space constraints and tradeoffs to optimize full-quantum-computer-system performance.  

Responsibilities:

• Lead the full packaging development lifecycle of novel hybrid optical and electronic systems; including detailed CAD design, document control, experiment reports and statements of work for internal and external activities,.
• Procure components, tools, fixtures and materials for hands-on characterization, testing, and validation of custom ultra-high vacuum packages for ion traps.
• Coordinate with other quantum system leads to define and explore subsystem interfaces and constraints.
• Scope and set objectives for new technical projects centered on thermomechanical packaging analysis.
• Develop project timelines, identifying key decision dates and completion dates.
• Conduct risk analysis and develop mitigation plans to ensure on-time release and delivery of project deliverables.
• Assist with the transition from research and development to production, including development of first articles and technology demonstrations

You'd be a good fit with :

• Bachelors or higher in Mechanical Engineering or relevant field/discipline
• 5+ years of hands-on electronics or optics device packaging experience, especially with systems which undergo thermal stress cycling
• 5+ years leading a high-precision R&D packaging development effort in industry
• Expertise using Solidworks
• Experience with thermal, electrical, and mechanical modeling of electronics packages in Ansys, COMSOL, or similar
• Expertise in identifying and using packaging techniques, components, and materials to manage mechanical stress and thermal expansion/contraction
• Experience with data aggregation and statistical analysis/reporting
• Excellent communication skills and ability to work on and lead a team

You'd be a great fit with : 

• PhD in Engineering or relevant field/discipline
• Ultra-High Vacuum (UHV) device/component handling and knowledge of cryogenic and UHV-compatible materials
• Experience with micro-optics assembly and packaging
• Programming experience in MATLAB, Python, or other engineering relevant language
• Process development experience using Design of Experiments and Six Sigma methodologies