Job Details:

Job Description: 

Job Description:
Lead the product development engineering team to drive testability and manufacturability of integrated circuits from the component feasibility stage through production ramp. Defines and sets priorities for the product development team, plans and provides support to meet schedules, standards, and cost. Evaluates and influences product design and supply chain requirements for appropriate manufacturing and quality processes, systems, tools, and procedures for testability and manufacturability. Lead the interaction across the company with business unit, design, validation, process development, fab, assembly/test, supply chain, and other groups to ensure product development achieves quality, schedule, and cost criteria.

Leads team efforts in unit cost reductions through test time reduction and content optimization methodologies as well as other efforts to drive continuous improvement in support of operational excellence. Provides oversight in yield and quality improvement activities through data analysis, debug, root cause, and implementation into production. Communicates manufacturing project status and/or risk to leadership forums. Responsible for enabling teams to execute through clear goal setting, facilitating work, maintaining accountability and driving team results. Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and ensuring a productive work environment.

Responsibilities:

• Candidate will be responsible for driving a range of disciplines:
• Ensuring the testability and manufacturability of integrated circuits from the component feasibility stage through production ramp.
• Make significant contributions to design, development and validation of testability circuits.
• Evaluation, development and debug of complex test methods.
• Develop and debug complex software programs to convert design validation vectors and drive complex test equipment.
• Develop production test hardware solutions. Test, validate, modify and redesign circuits to guarantee component margin to specification.
• Analyze and evaluate component specification versus performance to ensure optimal match of component requirements with production equipment capability with specific emphasis on yield analysis and bin split capability.
• Analyze early customer returns with emphasis on driving test hole closure activities.
• Create and apply concepts for optimizing component production relative to both quality and cost constraints.
• Autonomously plan and schedule own daily tasks, develops solutions to problems utilizing formal education and judgment. The ideal candidate will exhibit:
• Strong analytical and problem-solving skills with a proven track record of creating and implementing integrated, multidiscipline solutions.
• Ability to work in unstructured environments and to initiate and drive new model path finding activity from ambiguity (concepts) to clarity (defined direction and development)
• Exceptional interpersonal communication, relationship management, effective listening and influencing skills that result in strong working partnerships across organization boundaries.

Qualifications:

Qualifications:

• BSEE with 15+ years relevant experience or MSEE with 10+ years relevant experience required in the following areas:
• Microprocessor test (ATE and/or system test and/or pre-silicon verification) experience
• 10+ years of applicable experience in pre-silicon and post-silicon test development.
• Strong background and knowledge in hardware architecture, analog/logic/memory design and implementation.
• The ideal candidate will exhibit:
• Strong analytical and problem-solving skills with a proven track record of creating and implementing integrated, multidiscipline solutions.
• Ability to work in unstructured environments and to initiate and drive new model path finding activity from ambiguity (concepts) to clarity (defined direction and development)
• Exceptional interpersonal communication, relationship management, effective listening and influencing skills that result in strong working partnerships across organization boundaries.
• Knowledge of circuit design/Si process/test domains.
• Chipset integrated circuit testing and high-volume manufacturing experience would be an added advantage.
   

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Penang

Additional Locations:

Business group:

The Network & Edge Group brings together our network connectivity and edge into a business unit chartered to drive technology end to end product leadership. It's leadership Ethernet, Switch, IPU, Photonics, Network and Edge portfolio is comprised of leadership products critically important to our customers.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.