Job Details:

Job Description: 

About the team and organization: Compact Device Modeling Group (CDMG) is part of Intel's Design Enablement (DE) organization. DE is a key pillar in enabling Intel to deliver design, development and manufacturing services that allow internal and external customers to deliver winning products to the marketplace. Your work will directly enable design teams to get to the market faster with leadership products based on innovative technologies. As a member of CDMG you will be at the forefront of co-optimizing Intel's state-of-the-art process technology which allows customers with diverse design needs to enable best-in-class products for data-centric applications.

As a senior staff semiconductor device modeling engineer, you will be the senior member in Taiwan to support compact modeling activities for Intel's new technologies.

Qualifications:

Minimum Qualifications:

• A Master's degree in electrical engineering or related discipline, with a minimum of 10 years of industry experience in the semiconductor field. Or a PHD in electrical engineering or related discipline, with a minimum of 5 years of industry experience in the semiconductor field.

• Minimum of 5 years of Experience in BSIM models and other compact models, extraction tools (ICCAP or MBP), and commercially available simulators example: HSPICE, SPECTRE, etc.)

• Hands-on experience developing corner, statistical and sub-circuit models.

• Hands-on experience in developing LLE models for finfet technologies

• Hands-on experience in Python or C, Shell programming.

• Comprehensive background in semiconductor device physics, process flow, layout and simple circuit design and simulation.

• Experienced in a Cadence design environment, including schematic capture, analog design environment, virtuoso layout design, DRC, LVS, and layout extractions.

• Strong communication skills and leadership skills. The ability to work and coordinate with multiple groups and partners, and mentor junior engineers.

Preferred Qualifications:

• A Ph.D. degree in electrical engineering or related discipline with 10 + years of industry experience in the semiconductor field.

• Hands-on experience in semiconductor device DC/CV characterization tools, techniques, and systems. Experience in test automation and RF/noise/reliability tests is a plus.

• Understanding of Aging Simulations, reliability model methodologies and tools is a plus.

• Direct project and people management experiences.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Taiwan)

Primary Location: 

Taiwan, Hsinchu

Additional Locations:

Taiwan, Taipei

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.