Job Details:

Job Description: 

We are seeking experienced product engineers to contribute to the development, optimization, and implementation of component-level test strategies for our next generation NAND Flash memory products. This role is critical in ensuring that our NAND products meet the necessary specifications and quality standards before they reach the market. This is an excellent opportunity for experienced engineers seeking to work on industry leading QLC NAND technology critical for building datacenter storage solutions in the AI era.

Major responsibilities include:

• Develop burn-in and high speed I/O test specs, methodologies, and validation plans for NAND flash memory components.
• Work closely with test development engineers to validate and deploy test flows on high volume manufacturing platforms, enabling teams to assess functionality, performance, and reliability of NAND components.
• Analyze test data to identify trends, anomalies, and areas for improvement in product design or manufacturing processes.
• Optimize test methodologies to improve test coverage, efficiency, and cycle time.
• Provide technical expertise and support for yield enhancement and failure analysis activities.
• Collaborate with design, process, and reliability engineering teams to troubleshoot and resolve complex test failures.

Qualifications:

Minimum Qualifications:

• Degree's and Master's degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Circuit Design, or related fields.
• 4+ years of experience in logic/memory product engineering or test engineering.
• Proficient in statistical data analysis and electrical failure analysis to segment and determine root cause of test failures.
• Knowledge of NAND Flash memory technology, including architecture and operation.
• Functional knowledge of burn-in and high speed I/O test platforms and architectures.
• Excellent communication and teamwork abilities, with experience working in a multi-disciplinary engineering environment.
• Proven track record of technical leadership and ability to work independently.

Preferred Qualifications:

• 8+ years of experience in memory product/test engineering, with majority of it in NAND Flash.
• Experienced in defining burn-in/high speed I/O test specs and methodologies on multiple logic/memory products from TD phase to mass production phase.
• Extensive experience in development/validation/optimization of high speed I/O testing methodologies, with consideration of fabrication process and design corners.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Taiwan)

Primary Location: 

Taiwan, Hsinchu

Additional Locations:

Business group:

Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.