Job Details:

Job Description: 

As a Quality and Reliability Engineer, you'll join a team developing leading edge semiconductor package technologies for Intel's latest products. We use a wide variety of skills, from analytical models to advanced experimental designs to extensive data analysis, to evaluate and improve the package technology. Together with our technology development partners, we find the root cause of failure mechanisms and devise solutions.We measure our success by delivering world-class quality on cutting edge package technologies, faster and at a competitive cost.

The Quality and Reliability Engineer will be responsible for but not limited to:

• Set reliability requirements for next generation package technologies based on customer use conditions.
• Influence new package technology design, process and material decisions based on fundamental technical knowledge.
• Design test vehicles to isolate failure mechanisms and the root causes.Innovate analytical and experimental methods to validate package technology reliability.
• Deliver analysis results and impact to multiple levels within the quality and reliability community and business partners.

In addition to the above a successful candidate will demonstrate:

Leading and influencing cross-functional teams to achieve extraordinary results.

Created detail project plans and clear communication strategies to advocate effective change.

Examples of making the complex simple and understood by a wide audience.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum skills and experience:

Candidate must possess a Ph.D. or Master's degree in Mechanical Engineering, Material Science, Physics, Chemical Engineering, Chemistry, Electrical Engineering or related field of study.

3+ months(s) of experience in thermomechanical characterization of materials.

3+ months of experience in Packaging assembly and testing, accelerated environmental testing, reliability testing and standards.

6+ months of experience with empirical data collection and statistical data analysis.

Preferred skills and experience:

Semiconductor fabrication process, automated test and/or board system technology operations.

Leading and influencing cross-functional teams to achieve extraordinary results.

Created detail project plans and clear communication strategies to advocate effective change.

Examples of making the complex simple and understood by a wide audience.

Proficiency with any of the following imaging and analytical lab techniques: such as acoustic imaging, x-ray imaging, SEM, EDX, TEM, FTIR, TMA, DMA, DSC, TGA, SIMS and mechanical testing machines.

Programming or scripting for data analysis such as SQL PF, Python.

Experience with statistical software and analysis, JMP, MATLAB, Excel Macros, or equivalent.

          

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more information about all of our Amazing Benefits here:  https://www.intel.com/content/www/us/en/jobs/benefits.html

Annual Salary Range for jobs which could be performed in the US:

$105,797.00-$175,105.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.