Package Engineering Technician

Location: Malaysia, Kulim

Time Type: Full time

Job Description

Job Details:

Job Description: 

• Engineer Technician plays a critical role supports the development of printed circuit board assembly (PCBA) processes and/or equipment for assembly packaging platform technologies to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• In this role, you perform functions associated with all board manufacturing including build readiness, manufacturing operation, equipment operation, recipe creation and optimization, manufacturing system configuration, inventory management, equipment maintenance and process improvement.
• Collects and evaluates operating/engineering data to conduct on-line equipment adjustment and ensure process optimization.
• Responsible for running build, operating equipment in a qualitative way. Responsible for equipment health - stability, preventive maintenance, troubleshooting, spares, and sustaining.
• Responsible for improvement processes, troubleshooting nonstandard events in the production line including reviewing tool and process health and stability. May responsible for the buddy, trainer, and certifier levels and is in charge of updating training manuals.
• We are interested in candidate who exhibit behavioral traits and/or skills: Detail oriented, self-starter with the ability to multitask and continuous learning.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Possess a diploma in Mechanical or Electronics or Computer Science or manufacturing
• OR possess Certificate of technical skills in equivalent technical field with 3 years in experience in Manufacturing/Lab operations OR 5 years in Manufacturing/Lab operations.

Preferred Qualifications:

• 6+ months of experience in one or more of the following: Board assembly process/solder paste print/placement/reflow/XRay/inspection.
• IPC certification

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Kulim

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.