Job Details:

Job Description: 

Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory and storage business. and Intel will continue to manufacture NAND wafers at the Dalian memory manufacturing until the final closing expected to occur in March 2025. Intel DMTM will continue to build on the success of our NAND technology at a greater scale, play a larger role in supporting our customers. Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost indicator goals.Grows insitu manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe.Senior Dry Etch Equipment Engineer are responsible for managing the technical aspects of equipment and vendor engagement and area tool installations, relocations, retrofits activities. As well as optimizing existing tool performance. Additional responsibilities include, but are not limited to: -Completing all required safety training and ensure all work is conducted in accordance with Intel safety policies -Managing equipment vendor Continuous Improvement Projects (CIP) and addressing gaps -Managing performance and facilitating the development of the equipment owners -Partnering with equipment vendors and holding them accountable to projects and deliverables -Partnering with equipment vendors and the Intel network to identify technology roadmaps (emerging technology and obsolescence) -Managing program/project rollouts dealing with equipment improvement activities and providing updates -Identifying and proposing area equipment projects with clear goals and objectives -Identifying gaps in tool matching and partnering with equipment owners to find and resolve root causes -Tracking the successes of programs/projects and identifying/addressing gaps in effectiveness -Monitoring warranty status and following up on issues -Preparing for and driving area vendor regular meetings -Researching and identifying global area equipment BKMs and aligning local processes -Coordinating tool install schedules and following up on issues -Attending factory meetings to report on install status and following up on capacity issues -Establishing timelines and milestones for equipment installs, upgrades, and sustainment projects -Participating in applicable area, vendor, fab, and facilities meetings -Developing new resources to address area equipment reporting gaps -Coordinating vendor training events and assisting leadership with equipment engineering development needs -Partnering with the TD team to assist in the creating of new equipment training and documentation -Attending daily pass down meetings and communicate current and upcoming tool issues and mitigation plans -Maintaining flexibility to be on call to address shift needs -Reducing defects, improving tool availability, and finding solutions to ongoing problems -Identifying, quantifying, and qualifying cost reduction projects -Creating reports summarizing equipment availability, variability, improvements, and cost reduction projects -Supporting and maintaining HPM, LEAN and WPO activities

Qualifications:

-BS degree or above in an engineering related field or equivalent experience. -At least 5 years of semiconductor experience is required. -Direct experience and expert on LAM/AMAT/TEL tools. -Advanced understanding of semiconductor equipment and processes -Proven ability to communicate and present effectively -Advanced project management and time management skills -Proven change management skills -Proven ability to troubleshoot complex problems and address root causes -Advanced data extraction, analysis, and reporting skills -Strong partnering and teamwork skills -Proven ability to manage vendor relationships and achieve a high degree of execution -Advanced PC skills, including Microsoft Word, PowerPoint, and Excel -Proven ability to multi-task multiple complex projects and execute based on priority -Proven ability to engage large groups and single individuals on highly technical material -Demonstrated ability to interface with team members at all levels of the organization -Proven ability to mentor and coach team members

          

Job Type:

Experienced Hire

Shift:

Shift 1 (China)

Primary Location: 

PRC, Dalian

Additional Locations:

Business group:

Employees in Intel's NAND Product Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.