Senior Thermal Engineer – Hybrid Solutions (Poly)

Senior Thermal Engineer – Hybrid Solutions (Poly)

Description -

The Senior Thermal Engineer is a critical role within the HP Hybrid Solutions (Poly) team. This position requires a knowledgeable and experienced as end to end thermal engineer, with responsibilities to include the delivery of the videoconferencing products thermal design through the planning and execution of HP Poly Video Product, in order to meet customer requirements while ensuring the highest quality video products.  

The position will be responsible for working with a global design team to understanding the product specification, developing project level of thermal solution on videoconferencing products over multiple projects with outsourced development partners and providing ODM execution oversight and direction, execution of test audit, support for critical issue characterization and debug, understanding and maintaining issue tracking through the appropriate records database, and tracking project design progress and status for the HP Hybrid Solutions (Poly) product development team and management. Central to the success of this role is the ability to drive execution at ODM vendors with aggressive schedules and interface with a multinational team to solve complex technical issues using data-driven decision-making, and experience in delivering mass-produced hardware.

Responsibilities:

• Designs engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with development technology practices and guidelines for HP Hybrid Solutions (Poly) video product (Conference/Webcam).

• Develops and implements parameters and test plans for new and existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics.

• Interact with mechanical, electrical and camera architect to develop optimum platform design architecture, new and innovative concept ideas using the latest technologies based on marketing requirement, and review RFQ process and new components.

• Collaborates and communicates with management, internal, and outsourced development partners regarding design status, project progress, and issue resolution.

• Leads a project and collaborates internal and outsourced development partners to develop reliable, cost effective and high quality solutions for moderately- complex products.

• Represents the thermal function for all phases of larger and more-complex development projects.

• Drives innovation and integration of new technologies into projects and activities in the thermal design through HW/FW developments.

• Drives POC (proof of concept) with HW and FW/SW development to prove the new technologies and implementation to further products

• Provides guidance and mentoring to less- experienced staff members.

Education and Experience Required:

• Bachelor's or Master's degree in Mechanical Engineering with a focus on thermal fluids

• Typically 10+ years experience.

Knowledge and Skills:

• Strong analytical and problem solving skills.

• Strong understanding and experience in electronics packaging.

• Experience with but not limited to fanless, fan, heat pipe, and heatsink design.

• Experience using various thermal interface materials.

• Experience relating component/skin temperature, acoustics, and system performance

• Experience using thermal simulation tool and is able to created thermal simulation model.

• Experience with thermal tool on ARM/Android/Linux based.

• Experience with thermal design in video product (Conference/Webcam).

• Using CFD and thermal mockups to validate thermal solution.

• Excellent written and verbal communication skills; mastery in English and local language.

• Ability to effectively communicate product architectures, design proposals and negotiate options at management levels.

• Project Management Professional.

#LI-POST

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (Taiwan)

Travel -

Relocation -

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

If you’d like more information about HP’s EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law – Supplement