HP

Principal System Thermal Performance Engineer

Austin, TX US
USD 118k - 118k
Python Matlab Julia
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Description
Principal System Thermal Performance Engineer

Description -

Job Summary

Poly|HP is seeking a Subject Matter Expert in thermal system design (EFD/CFD). This engineer will lead the development of thermal solutions for new product offerings in the HP|Poly Hybrid Solutions Video product portfolio.  As a member of the Innovation and Architecture engineering team, you will be responsible for the thermal design of our videoconferencing equipment, including but not limited to: Video Bars, Speaker Bars, Webcams, Compute Systems, and MPTZ Cameras.  The successful candidate must have a proven track-record as an individual contributor in subsystem modeling as well as full system EFD/CFD.  Knowledge of MCAD systems and thermal sims integration is a must.  This role is responsible for leading multiple project teams consisting of mechanical hardware engineers and internal/outsourced development partners. The role manages design, resources, schedules, and costs across multiple ongoing projects, and builds relationships with development partners. The role brings domain-specific expertise, providing leadership and mechanical/thermal perspective to cross-organization projects. The role evaluates designs for compliance with technology and drives innovation and integration of new technologies into projects.

What you’ll do:

  • Lead product manager, electrical, and mechanical architects with thermal solution recommendations on developing new design proposals so that the first design intent follows best practices, first principles and standard methodologies. 

  • Propose new physical models, components, or subsystems outside the scope of standard convection and forced air solutions. 

  • Actively engage on new mechanical designs to port MCAD to EFD/CFD tools feeding back basic model parameter needed for seamless integration. 

  • Own and grow the existing PTC database of thermal specific parts and parameters incorporating open source and HP internal repositories.  (Creo and Windchill)

  • Validate approaches with through prototype builds and testing.

  • Manages and expands relationships with internal and outsourced development partners on mechanical and thermal design and development.

  • Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality.

  • Provides domain-specific expertise and overall mechanical/thermal leadership and perspective to cross-organization projects, programs, and activities.

  • Interprets internal/external business challenges and recommends best practices to improve products, processes or services.

  • Drives innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization.

  • Solves problems in straightforward situations; analyzes possible solutions using technical experience and judgment and precedents.

  • Provides guidance and mentoring to less experienced staff members.

The above duties and responsibilities are representative of the nature and level of work assigned and are not necessarily all-inclusive.

We’d love to hear from you if you have the following:

Education and Experience Required

  • Four-year or Graduate Degree in Electrical Engineering, Computer Engineering, Computer Science, or any other related discipline or commensurate work experience or demonstrated competence.

  • Typically has 7-10 years of work experience, preferably in engineering design and solutions, implementation across hardware development lifecycle, or a related field.

Knowledge and Skills

  • 10+ years experience in simulation or methodology development using tools such as Julia, Python, Matlab

  • Foundational knowledge and background in heat transfer, thermodynamics, computational fluid dynamics, and control theory.

  • Experience modeling low order physical systems e.g. fans, sinks, SOC, heat pipes.

  • Experience using CFD tools like Ansys and Siemens.

  • Hands-On experience in thermal testing, airflow testing and acoustic testing. 

  • Solid Communication Skills, including the ability to express technical concepts through documentation and presentations. 

  • Understanding in control theory, gain tuning of PID loops and driving requirements.

  • Experience identifying critical problems, breaking them down to their essential elements, proposing novel and efficient solutions, and implementing solution for cross-functional stakeholders.


Cross-Org Skills
• Effective Communication
• Results Orientation
• Learning Agility
• Digital Fluency
• Customer Centricity

Impact & Scope
• Impacts function and leads and/or provides expertise to functional project teams and may participate in cross-functional initiatives.

Complexity
• Works on complex problems where analysis of situations or data requires an in-depth evaluation of multiple factors.

Disclaimer
• This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.

The base pay range for this role is $118,050.00 to $181,80.00 annually with additional opportunities for pay in the form of bonus and/or equity (applies to US candidates only).  Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

  • Health insurance
  • Dental insurance
  • Vision insurance
  • Long term/short term disability insurance
  • Employee assistance program
  • Flexible spending account
  • Life insurance
  • Generous time off policies, including; 
    • 4-12 weeks fully paid parental leave based on tenure
    • 11 paid holidays
    • Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Relocation -

Equal Opportunity Employer (EEO)

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

If you’d like more information about HP’s EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law – Supplement

HP
HP
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