This role is responsible for leading project teams and overseeing all phases of the product lifecycle, evaluating product designs and project operations, and risk mitigation. The role takes charge of troubleshooting efforts, driving design enhancements, and collaborating with various teams to achieve continuous improvements. The role applies advanced subject matter knowledge in contributing to cross-organizational projects, innovation, and the integration of new technologies and quality initiatives.

As a Product Electrical & Firmware engineer within the Operations Engineering department, he / she:

• Actively participates in the New Products Design phases working closely with R&D labs providing the required inputs from Operations perspective (manufacturability, serviceability, cost)

• Drives the transition from early prototype stages to volume production at Worldwide Manufacturing Partners (MPa), working closely with other HP organizations in Asia responsible for production management.

• Holds the engineering responsibility after production starts and improves the product and its related processes to optimize final product quality, cost and manufacturing efficiency.

All these activities take place in an environment of worldwide manufacturing and distribution, working with external Manufacturing Partners, as well as internal partners ranging from R&D, Supply Chain, regional distribution centers, to Marketing.

a) New product introduction – NPI (development and introduction phases)

Understand and analyze new product electrical hardware subsystems (mainly PCA – Printed Circuit Boards) and components to:

• Improve product reliability and quality, providing Design for manufacturing and serviceability feedback to R&D.

• Ensure design is compatible with the chosen manufacturing processes.

• Specify, design/outsource and qualify manufacturing equipment, tooling, tests and processes to guarantee industrialization. Provide support to production builds that happen during this phase at manufacturing site.

Understand and qualify firmware package to:

• Ensure it allows product’s manufacturing and testing

Guarantee that product launch can be done successfully in manufacturing by ensuring the readiness of manufacturing equipment, tooling, test and processes and by following up manufacturing metrics (Cp, Cpk, Stdev and others) to correct deviations in order to achieve the right level of manufacturing stability.

Execute transfer of product design and manufacturing processes "know-how" to engineering Team(s) at manufacturing partners and HP team supporting production.

Ensures de correct and on-time delivery of the electrical prototypes fabrication, test and assemble during different development stages (builds).

b) Current products engineering responsibility

Identify and solve the causes of product quality and reliability problems:

• Conduct failure analyses on products, materials and components, from customer and manufacturing data.

• Work with partners (within and outside HP) to identify and design solutions.

• Work closely with Customer Assurance team to effectively capture the main customer issues and drive their resolution.

• Defines and leads the new component’s qualification when End-of-Life (EoL) occurs. This usually includes the execution of multiple laboratory electrical test (signal integrity, thermal, stress tests, HALT and others)

c) Cost reduction

Review existing products design to reduce the parts and manufacturing costs:

• Identify opportunities and develop proposals.

• Evaluate technical feasibility of cost reduction proposals.

• Recommend projects to management where they are technically and financially sound.

• Manage execution of the projects through partners.

d) Redesign product

Design activity to ensure product’s quality, cost and Regulatory compliance since R&D releases it to Market, until it is discontinued. Design motivation examples are:

• New Regulatory recommendation or mandatory requirement, or modification of existing one (RoHS, Energy Start, Safety).

• New or incremental product’s specification in order to increase its Market target.

- Solid technical knowledge in area of influence (EE and FW) and manufacturing processes. Ms Electronics or Telecommunications Engineering or equivalent.

- Strong Leadership: Able to coordinate a team of EE engineers, assign tasks and priorities. Act as subject matter expert and be the focal point of the EE team.

- Analysis capacity: Analytical and creativity skills for engineering experiments and problem resolution.

- Strong Team Building: Able to build rapport with partners so that new ideas can be accepted smoothly; and to give/receive open and honest feedback in a positive attitude.

- Project Management skills: Able to deploy cross-organizational implementation plans thru partners, timely track progress, identify deviations and proactively take corrective actions.

- Excellent communication skills: ability to convey key messages to different stakeholders (Ops, program, management), covering organization in geographically dispersed.

- Results and performance driven: stretching goals and clear timelines set up, meticulous actions tracking and “can do” attitude to overcome roadblocks.

- Typically has 5 years of work experience, preferably in product engineering, operations, or a related field.