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3D Heterogeneous Integration Development Intern

GlobalFoundries

On-site
Malta, NY
Full-time
Internship
$42k–$83kPosted 11m ago

Real job — pulled straight from GlobalFoundries’s careers page · Verified October 15, 2026 · No reposts.

Job description

GlobalFoundries is hiring a 3D Heterogeneous Integration Development Intern — a full-time, based in Malta, NY role ($42k–$83k). Apply directly on GlobalFoundries's careers page below.

3D Heterogeneous Integration Development Intern (Summer 2027)

Location: USA - New York - Malta

Time Type: Full time

Job Description

About GlobalFoundries 

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com. 


Internship Program Overview: 

Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you’ll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives. 


Summary of Role: 

The 3D Heterogeneous Integration Development Intern will contribute to advanced packaging and process-integration development, including wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, through-silicon via/through-oxide via (TSV/TOV), and interposer technologies. The intern will work with engineering teams to conduct experiments, analyze technical data, model processes, and support daily integration and process-development activities. 


Essential Responsibilities include: 

  • Plan and perform design of experiments (DOEs) using internal semiconductor tooling and equipment at external partners. 
  • Analyze and interpret engineering data from experiments, process optimizations, and characterization activities. 
  • Develop or support process models to improve understanding of advanced packaging and integration performance. 
  • Assist engineers with daily integration, process-development, documentation, and technical problem-solving activities. 
  • Collaborate with process, materials, equipment, characterization, and external partner teams to support project objectives. 
  • Summarize experimental results and communicate technical findings and recommended next steps to project stakeholders. 

Other Responsibilities: 

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. 

Required Qualifications: 

  • Education – At least a sophomore at time of application and actively pursuing a Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or related field through an accredited degree program during the time of internship. 
  • Must have at least an overall 3.0 GPA and be in good academic standing. 
  • Language Fluency - English (Written & Verbal) 
  • Travel - Up to 10% 
  • Ability to work at least 40 hours per week during the internship. 

Preferred Qualifications:  

  • Prior related internship or co-op experience 
  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. 
  • Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making. 
  • Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. 
  • Strong written and verbal communication skills 
  • Strong planning & organizational skills 
  • Currently pursuing a PhD in Engineering or related field through an accredited degree program during the internship 
  • Experience with advanced semiconductor packaging, semiconductor integration, hybrid bonding, TSV/TOV, interposers, design of experiments, or engineering data analysis 
  • Availability for a six-month co-op assignment is preferred 

#InternshipProgramUS 


Expected Salary Range 

$20.00 - $40.00 

Expected Salary Range

$0.00 - $0.00

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address. 

 

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations. 

 

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory. 

 

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law 

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Frequently asked questions

What is the salary for 3D Heterogeneous Integration Development Intern at GlobalFoundries?

The estimated salary range for 3D Heterogeneous Integration Development Intern at GlobalFoundries is $42,000 - $83,000 USD per year.

What is the seniority level for 3D Heterogeneous Integration Development Intern at GlobalFoundries?

3D Heterogeneous Integration Development Intern at GlobalFoundries is a Internship level position.

How do I apply for 3D Heterogeneous Integration Development Intern at GlobalFoundries?

You can view the full description and apply for 3D Heterogeneous Integration Development Intern at GlobalFoundries on EchoJobs: https://echojobs.io/job/globalfoundries-3d-heterogeneous-integration-development-intern-summer-2027-7pqb2.