3D Heterogeneous Integration Engineer (2026 New College Graduate)

Location: USA - New York - Malta

Time Type: Full time

Job Description

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

 

Summary of Role: 

GlobalFoundries Fab8 is seeking a motivated integration engineer to become part of our state-of-the-art 300mm fabrication facility in Malta, New York. This role will drive new development to enable our next-generation advanced packaging R&D efforts.  

 

Essential Responsibilities:

• Lead TSV process development efforts and planning by working with the unit process engineers and directly with the tools & materials for the Malta Fab 8 Advanced Semiconductor fab.  

• Collaborate with OSATs (Outsourced Assembly and Test) to develop new wafer level Integration processes.  

• Develop expertise in the processes (such as ETCH, Litho, Plating, and CMP), materials and tooling leveraging available characterization resources.  

• Drive mechanistic understanding of failure modes.  

• Develop integration schemes to continuously improve yields and to reduce cycle-time and costs. Generate IP related to novel wafer integration & packaging technology.  

• Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.  

 

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

• Other duties as assigned by manager.

 

Required Qualifications:

• Education – PhD with completed defended thesis or Master's in Electrical Engineering and Materials Science or related field from an accredited degree program.

• Must have at least an overall 3.0 GPA and proven good academic standing.

• Language Fluency - English (Written & Verbal).

• Travel - Up to 10%.

 

Preferred Qualifications:

• Prior-related internship or co-op experience in process engineering or integration. 

• Fundamental knowledge of semiconductor packaging processes.  

• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.  

• Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.  

• Strong written and verbal communication skills.  

• Strong planning and organizational skills.  

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Expected Salary Range

$65,400.00 - $145,800.00

The exact Salary will be determined based on qualifications, experience and location.