Purpose of the position
Foxconn Technology Group, a global electronics manufacturing leader, seeks a Senior Test Engineer to lead automation workflow optimization, drive defect resolution in high-volume production, and ensure product reliability at scale. Once a part of the team you will have opportunity to troubleshoot equipment failures using oscilloscopes, multimeters, and spectrum analyzers to perform root cause analysis while monitoring production metrics to identify deviations and coordinate cross-functional solutions. Facilitate client protocol validation, document compliance outcomes, and ensure results meet performance specifications. Additionally, train new hires on theoretical knowledge and hands-on operations to enhance team execution capabilities.

Duties and Responsibilities
1. Monitor production metrics in real time, analyze anomalies, and drive corrective actions. Deliver onboarding training for new hires blending theory and hands-on practice.
2. Execute equipment/material performance evaluations to assure testing process reliability.
3. Conduct root-cause analysis of test errors and implement solutions to eliminate recurring defects.
4. Standardize production workflows and equipment maintenance to enhance line consistency.
5. Lead client Design of Experiments validations, document compliance reports, and resolve critical anomalies via cross-functional collaboration.
6.Adhere to company policies and Standard Operating Procedures in all operational workflows.

Education and work experience
1. Successful completion of 4-years of high school, or equivalent, plus completion of 4 years of college with a bachelor’s degree, plus attainment of a master’s degree. Degree required: Electronic information engineering
2. Proficient in electronic circuit design principles, with 3 to 8 years’ hands-on experience in PCB layout and circuit board development is a plus.

Working conditions

• Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork.
• Employees are continuously encouraged to learn and grow their careers in smart manufacturing.

Skills:
1. Proficient in electronic circuit design principles, with hands-on experience in PCB layout design and mobile device testing methodologies.
2. Results-driven professional with strong accountability, cross-functional collaboration, and adaptive problem-solving in high-pressure environments.
3. Skilled in MS Office Suite for data-driven reporting, presentation creation, and stakeholder communication.
4.Proficient in English is required; working knowledge of Mandarin is preferred but not required. Proficiency in Spanish is a plus.