Real job — pulled straight from Foth’s careers page · Verified September 5, 2026 · No reposts.
Job description
Foth is hiring a Mechanical Packaging Systems Engineering Intern — a full-time, based in Green Bay, WI role. Apply directly on Foth's careers page below.
Mechanical Packaging Systems Engineering Intern (Summer 2027)
Team: Mechanical
Location: Green Bay, Wisconsin
Commitment: Internship
Workplace Type: onsite
Curious about how products move from production to packaging? At Foth, our internship program provides a unique opportunity to learn from experienced engineers while contributing to projects that support real-world manufacturing operations. As a Mechanical Engineering Intern on our Packaging Systems Team, you'll gain hands-on experience supporting the design and optimization of packaging systems for a variety of industrial clients. Based in Green Bay, WI, you'll work with multidisciplinary teams on projects involving packaging equipment, automation technologies, material handling systems, and production line improvements. During this Summer 2027 internship, you'll develop technical and professional skills while gaining valuable insight into engineering design, project development, and industry best practices.
Primary Responsibilities:
- Support the design, evaluation, and improvement of packaging systems and production lines
- Assist with packaging line assessments and development of engineering recommendations
- Contribute to engineering deliverables such as equipment specifications, layouts, and testing plans
- Perform engineering analysis and calculations to support project design and execution.
- Participate in equipment testing, commissioning, and startup activities
- Gain hands-on experience through site visits and travel to client and vendor facilities
Required Qualifications:
- Pursuing a Bachelor's Degree in Mechanical Engineering, Industrial Engineering, or Mechanical Engineering Technology from an ABET-accredited program
- Previous experience with and/or coursework involving basic level AutoCAD Mechanical 2D functions
- GPA of 3.0 or greater
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You can view the full description and apply for Mechanical Packaging Systems Engineering Intern at Foth on EchoJobs: https://echojobs.io/job/foth-mechanical-packaging-systems-engineering-intern-summer-2027-qyl8r.