What you’ll do:

Eaton announced, on June 11, 2026, the intent to combine its Mobility Group (including both the Vehicle and eMobility segments) with a new company. We expect to complete this process by the end of the first half of 2027. The compensation and benefits that will initially be offered for this position are based on Eaton's plans, programs and practices. If you are offered and accept this position and are actively employed by the Mobility Group when the transaction closes, the new company will provide further details to employees concerning compensation and benefits at that time.

Our eMobility Low Voltage & Power Conversion business is looking for a technical specialist to advance the Vehicle Control and Wireless Controls portfolio, lead critical product-development programs, and build electronics and embedded-control capability across the global LVPC engineering organization. This position is based in Magarpatta City, Pune, India.

• Own and evolve system and electronics architectures for multiplexed switches, keypads, rotary controls, transmitters, receivers, I/O modules and remote-control systems.
• Provide technical leadership in analog and digital electronics, microcontroller-based designs, power supplies, signal conditioning, communications interfaces, schematic design, PCB layout reviews, component selection, EMC, reliability and manufacturability.
• Guide RF and wireless-system design, including transceiver and antenna selection, link-budget and coexistence analysis, interference mitigation, range, latency, regulatory compliance and security.
• Lead embedded hardware–software integration for CAN, J1939, LIN and related protocols, including diagnostics, bootloaders, calibration, fault handling and HMI/GUI features.
• Translate voice-of-customer, use cases and regulatory expectations into requirements, interfaces, architecture decisions, specifications, traceability and verification plans.
• Lead technical project execution and design reviews from concept through production launch, balancing performance, safety, cybersecurity, reliability, cost, schedule and serviceability.
• Define technology roadmaps covering platform modularity, standard communication stacks, next-generation MCU/RF architectures, advanced HMI, sensing, geofencing, obsolescence mitigation and product refresh.
• Establish verification strategies for functional, environmental, EMC/EMI, RF, communication, safety, cybersecurity, reliability and vehicle-level validation.
• Lead resolution of complex design, manufacturing, supplier, warranty and field issues using 8D, FRACAS, RedX, fault-tree analysis, FMEA and data-driven root-cause methods.
• Act as technical project leader for critical NPIs and mentor global engineers in electronics, systems, RF/wireless, embedded controls, design reviews and engineering standards.
• Partner with product strategy and business leaders to convert market needs into executable technology roadmaps, platform plans and engineering capability priorities.
• Engage OEM customers, application engineers and plants during RFQ, requirements clarification, integration, launch, field support and technical escalation.
• Drive design reuse, modular architectures, VAVE, component standardization, design-for-manufacturing/test and lifecycle strategies.
• Champion PROLaunch, Design for Six Sigma, requirements management, configuration control, cybersecurity and functional-safety processes.
• Build capability through coaching, reusable design guidelines, technical reviews, lessons learned, standards deployment and global collaboration.

Qualifications:

Bachelor’s or master’s degree in Electrical, Electronics, Communication, Embedded Systems, Mechatronics or a related engineering discipline; master’s degree preferred.

Typically 12+ years of product-development experience in automotive, commercial vehicle, off-highway, industrial controls or a Tier-1 environment, with demonstrated technical leadership across global teams.

Skills:

• Deep expertise in embedded electronic product design: analog/digital circuits, microcontrollers, power supplies, communication interfaces, schematics, PCB reviews, component engineering, EMC, reliability, test and manufacturing.
• Strong embedded firmware and hardware–software integration knowledge, including real-time control, diagnostics, bootloaders, failure handling, configuration management and debugging.
• Proficiency with CAN, SAE J1939 and LIN; UDS, Ethernet or other vehicle/industrial protocols are advantageous.
• Working expertise in RF/wireless design: transceivers, antennas, link budgets, coexistence, interference mitigation, range/latency optimization and regulatory certification.
• Experience with rugged operator controls such as switches, keypads, rotary controls, HMI/display products, transmitters, receivers, remote controls or mobile-machine I/O modules.
• Systems engineering capability in requirements, architecture, interfaces, trade studies, FMEA, verification, traceability and product-level validation.
• Knowledge of ISO 26262, Automotive SPICE, ISO/SAE 21434, EMC/EMI, environmental qualification and relevant radio regulations.
• Demonstrated delivery of complex NPI or product-refresh programs from concept through production.
• Strong structured problem solving using 8D, FRACAS, RedX, fault-tree analysis, DFMEA/PFMEA and statistical methods.