What you will be doing:
- Hardware Design: Lead the development of high-speed, high-performance hardware schematics for PCBs, ensuring the designs meet functional, electrical, and mechanical specifications.
- Signal Integrity: Perform detailed signal integrity analysis and simulations (including but not limited to reflection, crosstalk, impedance matching, and transmission line effects) to ensure robust high-frequency signal transmission and minimal noise interference.
- Thermal Analysis: Conduct thermal simulations and analysis on PCB designs to assess and mitigate heat generation and ensure efficient thermal management. Optimize component placement and design layout to enhance heat dissipation.
- Simulation & Tools: Utilize industry-standard tools such as SPICE, HyperLynx, CST, Ansys, or similar for signal integrity and thermal simulations to validate design performance before physical prototyping.
- Collaboration: Work closely with cross-functional teams, including software engineers, mechanical engineers, and manufacturing teams, to ensure that the hardware design integrates seamlessly into the overall system.
- Design Optimization: Recommend and implement design changes based on simulation results to improve the signal integrity and thermal performance of the product.
- Documentation: Provide detailed design documentation, simulation reports, and analysis results for internal review and manufacturing handoff.
- Problem Solving & Troubleshooting: Investigate and resolve design-related issues during the validation and testing phase, including signal and thermal anomalies.
What you bring to this role:
- Experience: Minimum of 5 years of hands-on experience in hardware design, signal integrity analysis, and thermal simulation, ideally within a high-performance or embedded systems environment.
- Skills:
- Strong expertise in schematic capture and PCB design tools (e.g., Altium, OrCAD, Cadence).
- Proficiency in signal integrity analysis tools (e.g., HyperLynx, SIwave, ADS, CST).
- Experience in performing thermal analysis using tools such as Ansys Icepak, FloTHERM, or similar.
- Solid understanding of PCB manufacturing processes and design for manufacturability (DFM).
- Familiarity with high-speed circuit design principles, including impedance control, differential pairs, and high-frequency components.
- Problem-Solving: Excellent analytical and problem-solving skills with the ability to independently drive design improvements.
- Communication: Strong written and verbal communication skills with the ability to present complex technical concepts to non-technical stakeholders.
- Team Player: Ability to work in a fast-paced, collaborative environment and contribute to multiple projects simultaneously.
Bonus points for the following:
- Experience with multi-layer high-speed PCB designs.
- Familiarity with FPGA and microcontroller and high-speed memory interface designs.
- Knowledge of advanced thermal management techniques, such as heat sinks, vias, and thermal vias.
- Experience with simulation automation and scripting is a plus.
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