Responsibilities
- Lead the design, development, and optimization of semiconductor-grade equipment for handling, processing, and characterizing diamond wafer products.
- Design and integrate high-precision semiconductor equipment, including robotic material-handling systems and motion control units, for cleanroom environments and micron-level precision.
- Collaborate with vendors and cross-functional teams to design and integrate complex semiconductor equipment components and automation systems into production lines.
- Work closely with manufacturing and process engineers to develop and implement automation solutions that enhance system efficiency, throughput, and reliability.
- Generate clear, detailed documentation of equipment designs, integration processes, and troubleshooting procedures.
Skills and Qualifications
- Bachelor's or Master's in Electrical, Mechanical, Semiconductor, Robotics Engineering, or a related field with 10+ years experience in equipment design.
- In-depth experience with semiconductor fabrication processes (e.g., wafer handling, deposition, etching) and equipment used in high-precision manufacturing environments.
- Expertise in 3D/2D CAD (e.g., SolidWorks), EDA/ECAD tools (e.g., KiCAD, DipTrace), and Python.
- Proficiency in GD&T and conducting micron-level tolerance analysis for semiconductor equipment.
- Hands-on experience with fabrication techniques (e.g., machining, soldering, electro-mechanical assembly) relevant to semiconductor equipment.
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