Senior Digital Hardware Design Engineer

Team: Hardware

Location: Raanana, Center District

Commitment: Full-time

Workplace Type: onsite

Key Responsibilities:

Hardware Design Execution: Own the full lifecycle of complex digital hardware boards from schematic capture, component selection, and power distribution network (PDN) design through to high-yield mass production.
Architecture Collaboration: Actively participate in defining the digital hardware architecture, collaborating closely on modular computing strategies, baseboard optimizations, and multi-sensor integration.
Intel & COM Express Integration: Lead the detailed layout and integration of high-performance Intel processors and COM Express (COMe) form factors, managing complex, dense high-speed buses (PCIe Gen 4/5, DDR4/DDR5, 10GbE, USB4).
Simulation & Signal Integrity: Execute rigorous pre- and post-layout Signal Integrity and Power Integrity (SI/PI) simulations to guarantee precise timing margins, stable power delivery, and low-noise performance on dense, fine-pitch BGA footprints.
Production Scale-Up & DFx: Champion Design for Excellence (DFM, DFA, DFT) methodologies, boundary-scan testability, and detailed verification hardware documentation to ensure flawless transfer to manufacturing lines and eliminate field escalations.
Cross-Discipline Collaboration: Work closely with subcontractors (layout) and other R&D disciplines—including FPGA, Embedded SW, Cyber, and Mechanical engineering—to resolve interdisciplinary space, thermal, and noise constraints.

Key Qualifications:

Required

B.Sc. in Electrical Engineering, Computer Engineering, or equivalent experience.

8+ years of proven experience as a board designer executing complex high-speed digital hardware projects through complete manufacturing cycles.

Deep, hands-on experience designing with Intel processors and implementing COM Express (COMe) architectures, alongside modern GPUs, FPGAs, or SoCs.

Proven track record routing and debugging a wide variety of hardware interfaces (Ethernet, PCIe, USB, MIPI, high-speed memory architectures).

Expertise leading multi-layer PCB design involving fine-pitch BGAs, high-density interconnects (HDI), via-in-pad structures, and strict layout subcontractor management.

Strong foundation in SI/PI fundamentals, simulation workflows, and hands-on laboratory debugging using high-bandwidth scopes and logic/protocol analyzers.

Personal Attributes: Exceptional independent project execution skills, strong problem-solving mindset, and excellent interpersonal skills to lead multi-disciplinary alignments.

Preferred

High proficiency with Altium Designer and advanced simulation toolsets (HyperLynx, Ansys, or equivalent).

Experience managing configuration and manufacturing parameters within Arena PLM.

Familiarity with regulatory frameworks and test standards (FCC/CE/MIC compliance, EMI/EMC shielding validation).

A foundational understanding of RF fundamentals to assist with mixed-signal isolation planning.